Inventor · disambiguated record
Hitoshi Nakayama
Also filed as: NAKAYAMA HITOSHI · NAKAYAMA HITOSHI P
59 granted patents·15 pending applications·843 citations·filing 1976–2024
98Inventor score
Top patents by PatentIndex Score
74 records- 0197US5534364ABattery box device for electric vehicleHONDA MOTOR CO LTD·Filed 1994·Granted Jul 9, 1996·232 cites·37 claims
- 0296US8785241B2Semiconductor device and manufacturing method thereofSASAGAWA SHINYA·Filed 2011·Granted Jul 22, 2014·25 cites·24 claims
- 0395US9837513B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2017·Granted Dec 5, 2017·10 cites·24 claims
- 0495US9640642B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2016·Granted May 2, 2017·11 cites·15 claims
- 0595US9379136B2Semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2014·Granted Jun 28, 2016·17 cites·18 claims
- 0693US8597992B2Transistor and manufacturing method of the sameSASAGAWA SHINYA·Filed 2011·Granted Dec 3, 2013·17 cites·24 claims
- 0793US6946751B2Wind power generation systemMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 20, 2005·98 cites·13 claims
- 0892US9373708B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2015·Granted Jun 21, 2016·7 cites·14 claims
- 0992US5084962AApparatus for and method of automatically mounting electronic component on printed circuit boardTDK CORP·Filed 1989·Granted Feb 4, 1992·67 cites·23 claims
- 1091US9093539B2Semiconductor device and method for manufacturing the sameSASAGAWA SHINYA·Filed 2012·Granted Jul 28, 2015·10 cites·17 claims
- 1189US5878484AChip-type circuit element mounting apparatusTDK CORP·Filed 1995·Granted Mar 9, 1999·68 cites·26 claims
- 1287US11563340B2Power supply device, server, and power supply device management systemGS YUASA INT LTD·Filed 2018·Granted Jan 24, 2023·2 cites·18 claims
- 1385US5510658ACircuit breaker device for electric vehicleHONDA MOTOR CO LTD·Filed 1994·Granted Apr 23, 1996·61 cites·18 claims
- 1484US4583613AThree wheel motorcycle with reverse mechanismHONDA MOTOR CO LTD·Filed 1984·Granted Apr 22, 1986·37 cites·4 claims
- 1583US11257960B2Semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2019·Granted Feb 22, 2022·3 cites·15 claims
- 1681US12224293B2Oxide semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2023·Granted Feb 11, 2025·0 cites·18 claims
- 1780US10513117B2Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chipSII PRINTEK INC·Filed 2018·Granted Dec 24, 2019·1 cites·7 claims
- 1880US6435808B1Chip-type circuit element mounting apparatusTDK CORP·Filed 2000·Granted Aug 20, 2002·29 cites·10 claims
- 1978US8782879B2Workpiece transfer apparatusMIZUNO TORU·Filed 2012·Granted Jul 22, 2014·4 cites·7 claims
- 2077US9293892B2Short optical pulse generator, terahertz wave generation device, camera, imaging apparatus, and measurement apparatusSEIKO EPSON CORP·Filed 2013·Granted Mar 22, 2016·3 cites·20 claims
- 2176US11894397B2Semiconductor device and fabrication method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2022·Granted Feb 6, 2024·0 cites·8 claims
- 2275US8637354B2Semiconductor device and manufacturing method thereofSASAGAWA SHINYA·Filed 2011·Granted Jan 28, 2014·4 cites·38 claims
- 2372US9341567B2Terahertz wave generation device, light source device, camera, imaging device, and measurement deviceNAKAYAMA HITOSHI·Filed 2012·Granted May 17, 2016·3 cites·30 claims
- 2465US5998334APyrazole compounds, processes for their production and herbicides containing themISHIHARA SANGYO KAISHA·Filed 1997·Granted Dec 7, 1999·12 cites·18 claims
- 2561US11355530B2Semiconductor device and fabrication method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2019·Granted Jun 7, 2022·0 cites·16 claims
- 2660US5732001ACalculator with stepwise display of linear equationsSHARP KK·Filed 1995·Granted Mar 24, 1998·45 cites·22 claims
- 2759US12122159B2Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2022·Granted Oct 22, 2024·0 cites·7 claims
- 2859US4668793AProcess for producing 1,3-dimethyl-2-imidazolidinoneMITSUI TOATSU CHEMICALS·Filed 1985·Granted May 26, 1987·5 cites·7 claims
- 2959US2025100281A1Head chip, liquid jet head, liquid jet recording apparatus, and method of manufacturing head chipSII PRINTEK INC·Filed 2024·Application pending·0 cites
- 3058US11919306B2Method of manufacturing liquid jet head chip, liquid jet head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2021·Granted Mar 5, 2024·0 cites·8 claims
- 3157US12138927B2Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2022·Granted Nov 12, 2024·0 cites·8 claims
- 3256US10967636B2Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2019·Granted Apr 6, 2021·0 cites·11 claims
- 3356US10046563B2Liquid jet head, method of manufacturing liquid jet head, and liquid jet deviceSII PRINTEK INC·Filed 2016·Granted Aug 14, 2018·0 cites·14 claims
- 3456US2024198670A1Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2023·Application pending·0 cites
- 3556US2024198674A1Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2023·Application pending·0 cites
- 3655US12257840B2Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2022·Granted Mar 25, 2025·0 cites·7 claims
- 3755US11951749B2Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2021·Granted Apr 9, 2024·0 cites·8 claims
- 3855US7983319B2Surface-emitting type semiconductor laser that controls polarization directions of laser light and method for manufacturing the sameSEIKO EPSON CORP·Filed 2009·Granted Jul 19, 2011·0 cites·2 claims
- 3954US12257839B2Head chip, liquid jet head, and liquid jet recording deviceSII PRINTEK INC·Filed 2022·Granted Mar 25, 2025·0 cites·6 claims
- 4054US7192150B2Work piece holding apparatus, work piece illumination apparatus and work piece inspection systemTDK CORP·Filed 2004·Granted Mar 20, 2007·6 cites·6 claims
- 4153US10471716B2Liquid ejecting head chip, liquid ejecting head, and liquid ejecting apparatusSII PRINTEK INC·Filed 2018·Granted Nov 12, 2019·0 cites·14 claims
- 4253US9374936B2Workpiece mounting apparatusTDK CORP·Filed 2014·Granted Jun 21, 2016·0 cites·1 claims
- 4352US11072176B2Liquid jet head chip, liquid jet head, liquid jet recording device, and method of forming liquid jet head chipSII PRINTEK INC·Filed 2019·Granted Jul 27, 2021·0 cites·14 claims
- 4451US10279591B2Manufacturing method of liquid ejecting head chipSII PRINTEK INC·Filed 2018·Granted May 7, 2019·0 cites·4 claims
- 4551US2008179298A1Method of detecting an object to be detected in a joining device, joining device, and joining methodTDK CORP·Filed 2008·Application pending·0 cites
- 4651US2015168296A1Short optical pulse generator, terahertz wave generator, camera, imaging apparatus, and measurement apparatusSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 4750US7486713B2Surface-emitting type semiconductor laser and method for manufacturing the sameSEIKO EPSON CORP·Filed 2004·Granted Feb 3, 2009·2 cites·8 claims
- 4850US5007242AThermoelectric humidifier and display case provided with such humidifierSNOW BRAND MILK PRODUCTS CO LTD·Filed 1989·Granted Apr 16, 1991·17 cites·7 claims
- 4949US6152679AChip-type circuit element mounting apparatusTDK CORP·Filed 1999·Granted Nov 28, 2000·12 cites·4 claims
- 5048US8247308B2Method for manufacturing SOI substrateISHIZUKA AKIHIRO·Filed 2009·Granted Aug 21, 2012·0 cites·16 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →