Inventor · disambiguated record
Hideo Nakayoshi
Also filed as: NAKAYOSHI HIDEO
5 granted patents·368 citations·filing 1990–2004
85Inventor score
Top patents by PatentIndex Score
5 records- 0194US6294439B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 25, 2001·139 cites·26 claims
- 0290US6337258B1Method of dividing a waferTOSHIBA KK·Filed 2000·Granted Jan 8, 2002·59 cites·16 claims
- 0383US6184109B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1999·Granted Feb 6, 2001·76 cites·30 claims
- 0482US5107325AStructure and method of packaging a semiconductor deviceSEIKO EPSON CORP·Filed 1990·Granted Apr 21, 1992·85 cites·19 claims
- 0560US7071576B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Jul 4, 2006·9 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →