Inventor · disambiguated record
Hirohisa Narahashi
Also filed as: NARAHASHI HIROHISA
5 granted patents·2 pending applications·20 citations·filing 2009–2020
74Inventor score
Top patents by PatentIndex Score
7 records- 0186US8382996B2Metal-clad laminateAJINOMOTO KK·Filed 2010·Granted Feb 26, 2013·8 cites·32 claims
- 0280US8357443B2Laminate including water soluble release layer for producing circuit board and method of producing circuit boardAJINOMOTO KK·Filed 2009·Granted Jan 22, 2013·4 cites·18 claims
- 0378US8584352B2Process for producing multilayer printed wiring boardNARAHASHI HIROHISA·Filed 2010·Granted Nov 19, 2013·8 cites·56 claims
- 0460US11482437B2Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring boardAJINOMOTO KK·Filed 2020·Granted Oct 25, 2022·0 cites·6 claims
- 0550US2010040874A1Film for metal film transfer, method for transferring metal film and method for manufacturing circuit boardAJINOMOTO KK·Filed 2009·Application pending·0 cites
- 0649US11121020B2Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring boardAJINOMOTO KK·Filed 2017·Granted Sep 14, 2021·0 cites·15 claims
- 0736US2017290148A1Method for producing printed wiring boardAJINOMOTO KK·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →