Inventor · disambiguated record
Hidekazu Nasu
Also filed as: NASU HIDEKAZU
3 granted patents·18 citations·filing 1995–2011
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0173US8723303B2Multi-chip package semiconductor memory deviceNASU HIDEKAZU·Filed 2011·Granted May 13, 2014·6 cites·5 claims
- 0255US9070482B2Multi-chip package semiconductor memory deviceMIYAZAKI SATOSHI·Filed 2011·Granted Jun 30, 2015·1 cites·5 claims
- 0342US6002181AStructure of resin molded type semiconductor device with embedded thermal dissipatorOKI ELECTRIC IND CO LTD·Filed 1995·Granted Dec 14, 1999·11 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →