Inventor · disambiguated record
Hiroshi Natsui
Also filed as: NATSUI HIROSHI
4 granted patents·3 pending applications·4 citations·filing 2008–2011
60Inventor score
Top patents by PatentIndex Score
7 records- 0176US9776157B2Thermally expandable microcapsule, method for producing thermally expandable microcapsule, foamable masterbatch, and foam molded articleMORITA HIROYUKI·Filed 2011·Granted Oct 3, 2017·3 cites·8 claims
- 0259US9504980B2Thermally expandable microcapsuleNATSUI HIROSHI·Filed 2011·Granted Nov 29, 2016·1 cites·6 claims
- 0350US8981226B2Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticleSASAKI TAKU·Filed 2008·Granted Mar 17, 2015·0 cites·5 claims
- 0442US2013303639A1Resin composition for expansion moldingYAMAUCHI HIROSHI·Filed 2011·Application pending·0 cites
- 0541US2013184362A1Foamable resin composition and foam molded bodyYAMAUCHI HIROSHI·Filed 2011·Application pending·0 cites
- 0640US2013085192A1Thermally expandable microcapsule and process for production of thermally expandable microcapsuleYAMAUCHI HIROSHI·Filed 2011·Application pending·0 cites
- 0731US8506850B2Conductive fine particles, anisotropic conductive element, and connection structureSASAKI TAKU·Filed 2010·Granted Aug 13, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →