Inventor · disambiguated record
Hien D. Nguyen
Also filed as: NGUYEN HIEN D
5 granted patents·15 citations·filing 2011–2015
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0186US9190391B2Three-dimensional chip-to-wafer integrationKELKAR AMIT SUBHASH·Filed 2011·Granted Nov 17, 2015·13 cites·8 claims
- 0268US8860222B2Techniques for wafer-level processing of QFN packagesMAXIM INTEGRATED PRODUCTS·Filed 2012·Granted Oct 14, 2014·2 cites·11 claims
- 0354US9472451B2Technique for wafer-level processing of QFN packagesMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Oct 18, 2016·0 cites·7 claims
- 0446US10032749B2Three-dimensional chip-to-wafer integrationMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Jul 24, 2018·0 cites·11 claims
- 0545US9219043B2Wafer-level package device having high-standoff peripheral solder bumpsMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Dec 22, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →