Inventor · disambiguated record
Hiromi Niiyama
Also filed as: NIIYAMA HIROMI
7 granted patents·367 citations·filing 1994–2001
89Inventor score
Files withTOSHIBA KK7
Top patents by PatentIndex Score
7 records- 0194US6465290B1Method of manufacturing a semiconductor device using a polymer film patternTOSHIBA KK·Filed 2001·Granted Oct 15, 2002·88 cites·19 claims
- 0293US5592024ASemiconductor device having a wiring layer with a barrier layerTOSHIBA KK·Filed 1994·Granted Jan 7, 1997·133 cites·5 claims
- 0391US6794286B2Process for fabricating a metal wiring and metal contact in a semicondutor deviceTOSHIBA KK·Filed 2000·Granted Sep 21, 2004·55 cites·11 claims
- 0474US6090699AMethod of making a semiconductor deviceTOSHIBA KK·Filed 1996·Granted Jul 18, 2000·35 cites·6 claims
- 0568US5994030APattern-forming method and lithographic systemTOSHIBA KK·Filed 1998·Granted Nov 30, 1999·23 cites·10 claims
- 0664US6020107APattern forming method through combined electron beam and light exposure utilizing multiple heat stepsTOSHIBA KK·Filed 1998·Granted Feb 1, 2000·22 cites·19 claims
- 0752US6093931APattern-forming method and lithographic systemTOSHIBA KK·Filed 1999·Granted Jul 25, 2000·11 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →