Inventor · disambiguated record
Hironobu Nishimura
Also filed as: NISHIMURA HIRONOBU
18 granted patents·5 pending applications·148 citations·filing 1996–2023
93Inventor score
Files withORIGIN ELECTRIC12NISHIMURA HIRONOBU3DAINIPPON PRINTING CO LTD2ORIGIN CO LTD2DAIKIN IND LTD1
Top patents by PatentIndex Score
23 records- 0188US10035221B2Metal bonded product and method for producing metal bonded productORIGIN ELECTRIC·Filed 2015·Granted Jul 31, 2018·4 cites·4 claims
- 0287US6478069B1Manufacturing method and apparatus for optical discORIGIN ELECTRIC·Filed 2000·Granted Nov 12, 2002·25 cites·10 claims
- 0386US12275273B2Raised woodgrain finish decorative materialDAINIPPON PRINTING CO LTD·Filed 2023·Granted Apr 15, 2025·1 cites·17 claims
- 0484US8117981B2Liquid material supplying apparatus and liquid material supplying methodNISHIMURA HIRONOBU·Filed 2007·Granted Feb 21, 2012·5 cites·12 claims
- 0581US11179814B2Clamping mechanism, apparatus for manufacturing joining member, and method for manufacturing joining memberORIGIN CO LTD·Filed 2020·Granted Nov 23, 2021·2 cites·7 claims
- 0681US7910161B2Manufacturing device and manufacturing method for optical discORIGIN ELECTRIC·Filed 2007·Granted Mar 22, 2011·4 cites·6 claims
- 0775US7828030B2Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatusORIGIN ELECTRIC·Filed 2007·Granted Nov 9, 2010·2 cites·2 claims
- 0867US6228203B1Disk bonding method and systemORIGIN ELECTRIC·Filed 1999·Granted May 8, 2001·25 cites·29 claims
- 0966US5743965ADisk coating systemORIGIN ELECTRIC·Filed 1996·Granted Apr 28, 1998·41 cites·17 claims
- 1064US5938891ADisk bonding systemORIGIN ELECTRIC·Filed 1997·Granted Aug 17, 1999·20 cites·48 claims
- 1161US2025205837A1Insert manufacturing apparatus, method of manufacturing insert, insert for cutting tool, and baseORIGIN CO LTD·Filed 2023·Application pending·0 cites
- 1259US6746564B2Manufacturing method and apparatus for optical discORIGIN ELECTRIC·Filed 2002·Granted Jun 8, 2004·7 cites·12 claims
- 1357US7279069B2Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatusORIGIN ELECTRIC·Filed 2002·Granted Oct 9, 2007·2 cites·4 claims
- 1457US6960270B2Optical disk producing device and producing methodORIGIN ELECTRIC·Filed 2002·Granted Nov 1, 2005·3 cites·19 claims
- 1554US6841140B2Method and apparatus for producing hydrogen fluorideDAIKIN IND LTD·Filed 2001·Granted Jan 11, 2005·7 cites·12 claims
- 1650US11772415B2Raised woodgrain finish decorative materialDAINIPPON PRINTING CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·10 claims
- 1750US9579740B2Thermal processing apparatusORIGIN ELECTRIC·Filed 2013·Granted Feb 28, 2017·0 cites·9 claims
- 1848US2009168114A1Image Forming Apparatus And Image Forming SystemOKI DATA KK·Filed 2008·Application pending·0 cites
- 1946US2004134603A1Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatusFiled 2003·Application pending·0 cites
- 2046US2016046067A1Composite material joining device, method for manufacturing joined body, and joined bodyORIGIN ELECTRIC·Filed 2014·Application pending·0 cites
- 2145US8130627B2Optical disc production apparatusNISHIMURA HIRONOBU·Filed 2006·Granted Mar 6, 2012·0 cites·15 claims
- 2241US8427682B2Information processing device that performs data access control through connecting to multiple devices and method thereofNISHIMURA HIRONOBU·Filed 2010·Granted Apr 23, 2013·0 cites·15 claims
- 2336US2010224767A1Photodetector, method for manufacturing the same, and photodetection systemTDK CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →