Inventor · disambiguated record
Hidekazu Nobuto
Also filed as: NOBUTO HIDEKAZU
4 granted patents·3 pending applications·9 citations·filing 2006–2019
68Inventor score
Top patents by PatentIndex Score
7 records- 0182US9768177B2Method of forming conductive material of a buried transistor gate line and method of forming a buried transistor gate lineMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 19, 2017·5 cites·23 claims
- 0274US11043414B2Microelectronic devices with conductive contacts to silicide regions, and related devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 22, 2021·2 cites·9 claims
- 0372US10002874B2Method of forming conductive material of a buried transistor gate line and method of forming a buried transistor gate lineMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·2 cites·11 claims
- 0438US11322502B2Apparatus including barrier materials within access line structures, and related methods and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted May 3, 2022·0 cites·26 claims
- 0537US2021126103A1Apparatus comprising wordlines comprising multiple metal materials, and related methods and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 0635US2008012058A1Semiconductor device and method of manufacturing sameELPIDA MEMORY INC·Filed 2006·Application pending·0 cites
- 0731US2015371991A1Semiconductor device and method for manufacturing sameNOBUTO HIDEKAZU·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →