Inventor · disambiguated record
Hiroyuki Nogawa
Also filed as: NOGAWA HIROYUKI
4 granted patents·3 pending applications·1 citations·filing 2017–2024
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0163US10090223B2Semiconductor device and method of manufacturing sameFUJI ELECTRIC CO LTD·Filed 2017·Granted Oct 2, 2018·1 cites·8 claims
- 0259US11531075B2Method and apparatus for integrating current sensors in a power semiconductor moduleWISCONSIN ALUMNI RES FOUND·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 0352US2024363508A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0450US2023402336A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0549US2024030211A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0646US11587861B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·13 claims
- 0745US11085977B2Method and apparatus for integrating current sensors in a power semiconductor moduleWISCONSIN ALUMNI RES FOUND·Filed 2017·Granted Aug 10, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →