Inventor · disambiguated record
Hiroshi Noro
Also filed as: NORO HIROSHI
26 granted patents·7 pending applications·330 citations·filing 1992–2013
95Inventor score
Top patents by PatentIndex Score
33 records- 0192US6333206B1Process for the production of semiconductor deviceNITTO DENKO CORP·Filed 1997·Granted Dec 25, 2001·167 cites·14 claims
- 0283US5458801AProcess for producing granular bleach activator composition and granular bleach activator compositionKAO CORP·Filed 1992·Granted Oct 17, 1995·49 cites·20 claims
- 0382US6617046B2Thermosetting resin composition and semiconductor device using the sameNITTO DENKO CORP·Filed 2002·Granted Sep 9, 2003·29 cites·9 claims
- 0468US8063009B2Bleaching activator granuleONODA KEIICHI·Filed 2007·Granted Nov 22, 2011·3 cites·16 claims
- 0568US7521122B2Laminated sheetNITTO DENKO CORP·Filed 2004·Granted Apr 21, 2009·12 cites·6 claims
- 0668US7312104B2Resin composition for encapsulating semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Dec 25, 2007·12 cites·11 claims
- 0765US9056941B2Photocurable resin composition and optical component using the sameHIGO YUKIKO·Filed 2010·Granted Jun 16, 2015·1 cites·6 claims
- 0865US8304470B2Resin composition for optical components, optical component using the same and production method of optical lensNORO HIROSHI·Filed 2009·Granted Nov 6, 2012·2 cites·8 claims
- 0965US2008286562A1Thermosetting encapsulation adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1064US8922031B2Thermosetting encapsulation adhesive sheetTOYODA EIJI·Filed 2012·Granted Dec 30, 2014·2 cites·2 claims
- 1163US6200830B1Fabrication process of a semiconductor deviceNITTO DENKO CORP·Filed 1999·Granted Mar 13, 2001·28 cites·7 claims
- 1262US6500794B1Granulated bleaching activatorKAO CORP·Filed 2000·Granted Dec 31, 2002·5 cites·6 claims
- 1359US7323437B2Process for producing a bleaching activator compositionKAO CORP·Filed 2004·Granted Jan 29, 2008·3 cites·12 claims
- 1457US8575227B2Photocurable resin composition and optical component using the sameHIGO YUKIKO·Filed 2011·Granted Nov 5, 2013·1 cites·4 claims
- 1556US9246063B2Phosphor encapsulating sheet, light emitting diode device, and producing method thereofNITTO DENKO CORP·Filed 2013·Granted Jan 26, 2016·0 cites·6 claims
- 1653US8722769B2Light-curing resin composition and optical materialHIGO YUKIKO·Filed 2011·Granted May 13, 2014·0 cites·4 claims
- 1753US7352069B2Electronic component unitNITTO DENKO CORP·Filed 2003·Granted Apr 1, 2008·5 cites·11 claims
- 1850US2009246918A1Method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1949US2009311630A1Process for producing optical componentNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2048US6916538B2Thermosetting resin composition and semiconductor device obtained with the sameNITTO DENKO CORP·Filed 2003·Granted Jul 12, 2005·4 cites·24 claims
- 2148US6429283B2Method of producing powderKAO CORP·Filed 2001·Granted Aug 6, 2002·1 cites·14 claims
- 2246US9117984B2Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Aug 25, 2015·0 cites·5 claims
- 2346US8198382B2Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the sameNORO HIROSHI·Filed 2008·Granted Jun 12, 2012·0 cites·6 claims
- 2446US7740742B2Powder composition for paper manufacturingKAO CORP·Filed 2004·Granted Jun 22, 2010·2 cites·9 claims
- 2544US8269213B2Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the sameNORO HIROSHI·Filed 2008·Granted Sep 18, 2012·0 cites·6 claims
- 2641US8557891B2Photocurable resin composition and optical component using the sameHIGO YUKIKO·Filed 2011·Granted Oct 15, 2013·0 cites·5 claims
- 2739US8319228B2Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor deviceTANIGUCHI TAKASHI·Filed 2010·Granted Nov 27, 2012·0 cites·6 claims
- 2839US2011201763A1Thermosetting resin composition for optical-semiconductor element encapsulation and cured material thereof, and optical-semiconductor device obtained using the sameNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2939US2005158557A1Resin composition for encapsulating semiconductorNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 3036US2010292358A1Resin composition for optical components and optical component using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3135US9056943B2Epoxy resin composition for optical semiconductor device and optical semiconductor device using the sameUCHIDA TAKAHIRO·Filed 2012·Granted Jun 16, 2015·0 cites·6 claims
- 3235US2011298003A1Epoxy resin composition for optical use, optical component using the same, and optical semiconductor device obtained using the sameUCHIDA TAKAHIRO·Filed 2011·Application pending·0 cites
- 3331US5263650AProcess for producing high bulk density granular detergentKAO CORP·Filed 1992·Granted Nov 23, 1993·4 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →