Inventor · disambiguated record
Hitoshi Nosaka
Also filed as: NOSAKA HITOSHI
2 granted patents·35 citations·filing 2004–2006
59Inventor score
Files withSEIKO EPSON CORP2
Top patents by PatentIndex Score
2 records- 0173US7017794B2Wire bonding method and wire bonding apparatusSEIKO EPSON CORP·Filed 2004·Granted Mar 28, 2006·32 cites·11 claims
- 0264US7608479B2Method of manufacturing semiconductor device and method of treating electrical connection sectionSEIKO EPSON CORP·Filed 2006·Granted Oct 27, 2009·3 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →