Inventor · disambiguated record
Hirotaka Ogawa
Also filed as: OGAWA HIROTAKA
6 granted patents·54 citations·filing 1998–2014
79Inventor score
Top patents by PatentIndex Score
6 records- 0179US9153549B2Semiconductor deviceNODA SCREEN CO LTD·Filed 2013·Granted Oct 6, 2015·7 cites·3 claims
- 0272US6276599B1Method and apparatus for forming solder bumpsNODA SCREEN CO LTD·Filed 1999·Granted Aug 21, 2001·40 cites·5 claims
- 0358US10149379B2Multi-layered circuit board and semiconductor deviceNODA SCREEN CO LTD·Filed 2014·Granted Dec 4, 2018·1 cites·6 claims
- 0452US6583849B1Apparatus for exposure of photo-curing resin applied to printed circuit boardNODA SCREEN CO LTD·Filed 2000·Granted Jun 24, 2003·4 cites·4 claims
- 0540US10214654B2Method for forming multilayer coating filmNIPPON PAINT AUTOMOTIVE COATINGS CO LTD·Filed 2014·Granted Feb 26, 2019·0 cites·5 claims
- 0629US6165544AMethod of exposure of photo-curing resin applied to printed circuit boardNODA SCREEN CO LTD·Filed 1998·Granted Dec 26, 2000·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →