Inventor · disambiguated record
Hidenori Ohata
Also filed as: OHATA HIDENORI
9 granted patents·6 pending applications·44 citations·filing 1997–2025
83Inventor score
Files withTDK CORP15
Top patents by PatentIndex Score
15 records- 0174US2025299081A1Non-reciprocal circuit element and quantum computerTDK CORP·Filed 2025·Application pending·0 cites
- 0262US6433649B2Non-reciprocal circuit element and millimeter-wave hybrid integrated circuit board with the non-reciprocal circuit elementTDK CORP·Filed 2001·Granted Aug 13, 2002·10 cites·14 claims
- 0362US2025322281A1Non-reciprocal circuit element and quantum computerTDK CORP·Filed 2025·Application pending·0 cites
- 0460US6215371B1Non-reciprocal circuit element with a capacitor between the shield conductor and ground to lower the operating frequencyTDK CORP·Filed 1998·Granted Apr 10, 2001·15 cites·8 claims
- 0556US10964994B2Nonreciprocal circuit element and communication apparatus using the sameTDK CORP·Filed 2019·Granted Mar 30, 2021·0 cites·14 claims
- 0654US11276909B2Nonreciprocal circuit element, manufacturing method of the same, and communication apparatus using the sameTDK CORP·Filed 2020·Granted Mar 15, 2022·0 cites·17 claims
- 0754US10992014B2Nonreciprocal circuit element and communication apparatus using the sameTDK CORP·Filed 2019·Granted Apr 27, 2021·0 cites·16 claims
- 0852US2023139241A1Non-reciprocal circuit element and communication apparatus having the sameTDK CORP·Filed 2022·Application pending·0 cites
- 0951US2023103827A1Non-reciprocal circuit element and communication apparatusTDK CORP·Filed 2022·Application pending·0 cites
- 1051US2023140741A1Non-reciprocal circuit element and communication apparatus having the sameTDK CORP·Filed 2022·Application pending·0 cites
- 1150US7286025B2Circulator elementTDK CORP·Filed 2005·Granted Oct 23, 2007·1 cites·15 claims
- 1249US2025357653A1Non-reciprocal circuit elementTDK CORP·Filed 2022·Application pending·0 cites
- 1347US10644369B2Non-reciprocal circuit device and communication apparatus using the sameTDK CORP·Filed 2017·Granted May 5, 2020·0 cites·10 claims
- 1444US6120884AConductor paste and multilayer ceramic part using the sameTDK CORP·Filed 1997·Granted Sep 19, 2000·12 cites·14 claims
- 1537US6235221B1Multilayer ceramic partTDK CORP·Filed 1999·Granted May 22, 2001·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →