Inventor · disambiguated record
Hiroyuki Ohme
Also filed as: OHME HIROYUKI
11 granted patents·2 pending applications·193 citations·filing 1998–2014
91Inventor score
Top patents by PatentIndex Score
13 records- 0198US7863382B2Resin composition and molded article comprising the sameTORAY INDUSTRIES·Filed 2005·Granted Jan 4, 2011·53 cites·8 claims
- 0297US8445593B2Resin composition and molded article comprising the sameISHII HIROMITSU·Filed 2010·Granted May 21, 2013·17 cites·10 claims
- 0396US7268190B2Resin composition comprising polylactic acid and polyacetal and a molded article, film, and fiber each comprising the sameTORAY INDUSTRIES·Filed 2002·Granted Sep 11, 2007·67 cites·10 claims
- 0492US7550541B2Resin composition and molded article, film and fiber each comprising the sameTORAY INDUSTRIES·Filed 2007·Granted Jun 23, 2009·13 cites·15 claims
- 0591US8193264B2Thermoplastic resin composition and molded article thereofKUMAZAWA SADANORI·Filed 2007·Granted Jun 5, 2012·11 cites·6 claims
- 0689US8829099B2Resin composition and molded article composed of the sameKUMAZAWA SADANORI·Filed 2006·Granted Sep 9, 2014·10 cites·23 claims
- 0784US9045631B2Thermoplastic resin compositionKUMAZAWA SADANORI·Filed 2012·Granted Jun 2, 2015·3 cites·6 claims
- 0883US7999021B2Resin composition and molded article made thereofTORAY INDUSTRIES·Filed 2006·Granted Aug 16, 2011·6 cites·10 claims
- 0968US6838529B2Polyester composition and connectorTORAY INDUSTRIES·Filed 2001·Granted Jan 4, 2005·7 cites·18 claims
- 1060US2014155534A1Resin composition and molded article composed of the sameTORAY INDUSTRIES·Filed 2014·Application pending·0 cites
- 1154US8664334B2Resin composition and molded article made thereofKUMAZAWA SADANORI·Filed 2011·Granted Mar 4, 2014·0 cites·10 claims
- 1244US2005080200A1Electrical connectorFiled 2004·Application pending·0 cites
- 1336US6060579AMethod for producing polybutylene terephthalateTORAY INDUSTRIES·Filed 1998·Granted May 9, 2000·6 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →