Inventor · disambiguated record
Hidebumi Ohnuki
Also filed as: OHNUKI HIDEBUMI
6 granted patents·141 citations·filing 1985–1995
85Inventor score
Top patents by PatentIndex Score
6 records- 0177US5218761AProcess for manufacturing printed wiring boardsNEC CORP·Filed 1992·Granted Jun 15, 1993·48 cites·8 claims
- 0268US4668332AMethod of making multi-layer printed wiring boardsNEC CORP·Filed 1985·Granted May 26, 1987·34 cites·6 claims
- 0364US5030373ASurface-treating agents for copper and copper alloyTOKAI ELECTRO CHEMICAL CO·Filed 1990·Granted Jul 9, 1991·17 cites·3 claims
- 0456US5480675AMethod of and apparatus for plating printed circuit boardNEC CORP·Filed 1994·Granted Jan 2, 1996·20 cites·9 claims
- 0554US5455393AMultilayered printed wiring board and method of manufacturing the sameNEC CORP·Filed 1993·Granted Oct 3, 1995·17 cites·9 claims
- 0632US5526564AMethod of manufacturing a multilayered printed wiring boardNEC CORP·Filed 1995·Granted Jun 18, 1996·5 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →