Inventor · disambiguated record
Hiizu Ohtorii
Also filed as: OHTORII HIIZU
17 granted patents·8 pending applications·188 citations·filing 1998–2022
93Inventor score
Top patents by PatentIndex Score
25 records- 0190US7366375B2Optical waveguide device, manufacturing method thereof, optical information processing apparatus, and electronic equipmentSONY CORP·Filed 2005·Granted Apr 29, 2008·28 cites·20 claims
- 0288US8384116B2Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing displaySONY CORP·Filed 2009·Granted Feb 26, 2013·15 cites·12 claims
- 0387US6722962B1Polishing system, polishing method, polishing pad, and method of forming polishing padSONY CORP·Filed 2000·Granted Apr 20, 2004·35 cites·4 claims
- 0482US7315669B2Photoelectric transducer and photoelectric transducer element arraySONY CORP·Filed 2005·Granted Jan 1, 2008·12 cites·20 claims
- 0580US8324029B2Method of transferring elements, element disposition substrate, device and method of manufacturing the sameOHTORII HIIZU·Filed 2009·Granted Dec 4, 2012·12 cites·12 claims
- 0675US7651279B2Optical-electrical transmission connector, optical-electrical transmission device and electronic deviceSONY CORP·Filed 2008·Granted Jan 26, 2010·7 cites·12 claims
- 0771US6139400APolishing system and method with polishing pad pressure adjustmentSONY CORP·Filed 1998·Granted Oct 31, 2000·31 cites·25 claims
- 0866US6520835B1Polishing system, polishing method, polishing pad, and method of forming polishing padSONY CORP·Filed 2000·Granted Feb 18, 2003·11 cites·4 claims
- 0966US6039631APolishing method, abrasive material, and polishing apparatusSONY CORP·Filed 1998·Granted Mar 21, 2000·34 cites·9 claims
- 1064US7622700B2Photo-electric conversion apparatus with alternating photoelectric conversion elementsSONY CORP·Filed 2005·Granted Nov 24, 2009·3 cites·2 claims
- 1159US12119371B2Light source apparatusSONY GROUP CORP·Filed 2020·Granted Oct 15, 2024·0 cites·23 claims
- 1254US2024405149A1Light receiving device, distance measurement apparatus, distance measurement module, electronic apparatus, and manufacturing method for a light receiving deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1353US12456669B2Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Oct 28, 2025·0 cites·44 claims
- 1450US2007051638A1Electropolishing liquid, electropolishing method, and method for fabricating semiconductor deviceSONY CORP·Filed 2006·Application pending·0 cites
- 1549US12078561B2Optical sensor and optical sensor moduleSONY GROUP CORP·Filed 2020·Granted Sep 3, 2024·0 cites·17 claims
- 1649US12025738B2Ranging device and ranging moduleSONY CORP·Filed 2019·Granted Jul 2, 2024·0 cites·24 claims
- 1748US2023003591A1Force sensor moduleSONY GROUP CORP·Filed 2020·Application pending·0 cites
- 1843US7033943B2Etching solution, etching method and method for manufacturing semiconductor deviceSONY CORP·Filed 2004·Granted Apr 25, 2006·0 cites·4 claims
- 1942US2022102230A1Semiconductor substrate and semiconductor moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Application pending·0 cites
- 2041US8637878B2Display panel, display device, illumination panel and illumination device, and methods of manufacturing display panel and illumination panelOHTORII HIIZU·Filed 2011·Granted Jan 28, 2014·0 cites·16 claims
- 2141US2004159557A1Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor deviceFiled 2003·Application pending·0 cites
- 2239US7141501B2Polishing method, polishing apparatus, and method of manufacturing semiconductor deviceSONY CORP·Filed 2003·Granted Nov 28, 2006·0 cites·2 claims
- 2338US2004259365A1Polishing method polishing system and method for fabricating semiconductor deviceFiled 2003·Application pending·0 cites
- 2437US2005178672A1Polishing method, polishing device, and method of manufacturing semiconductor equipmentFiled 2003·Application pending·0 cites
- 2532US2005224368A1Polishing system and polishing methodSATO SHUZO·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →