Inventor · disambiguated record
Hisao Oikawa
Also filed as: OIKAWA HISAO
13 granted patents·2 pending applications·97 citations·filing 2002–2021
91Inventor score
Top patents by PatentIndex Score
15 records- 0194US7868112B2Fluorine-containing polymer and resin compositionCHISSO CORP·Filed 2007·Granted Jan 11, 2011·19 cites·19 claims
- 0293US7687593B2Fluorinated polymer and polymer compositionCHISSO CORP·Filed 2006·Granted Mar 30, 2010·28 cites·26 claims
- 0388US7662985B2Production process for a silicon compoundCHISSO CORP·Filed 2009·Granted Feb 16, 2010·6 cites·1 claims
- 0488US7375170B2Organosilicon compoundCHISSO CORP·Filed 2005·Granted May 20, 2008·9 cites·53 claims
- 0587US7256243B2Silicon compoundCHISSO CORP·Filed 2005·Granted Aug 14, 2007·8 cites·54 claims
- 0678US7989560B2Fluorine-containing polymer and resin compositionCHISSO CORP·Filed 2007·Granted Aug 2, 2011·4 cites·15 claims
- 0777US7964692B2Polymer obtained by addition-polymerization initiated by a silicon compoundJNC CORP·Filed 2009·Granted Jun 21, 2011·2 cites·4 claims
- 0875US7563917B2Silicon compound and a production process for silicon compoundCHISSO CORP·Filed 2006·Granted Jul 21, 2009·2 cites·10 claims
- 0973US7129370B2Silicon compound and a production process for silicon compoundCHISSO CORP·Filed 2003·Granted Oct 31, 2006·6 cites·30 claims
- 1066US8445613B2Polymer and surface-treating agent containing the polymerITO KENYA·Filed 2008·Granted May 21, 2013·2 cites·7 claims
- 1165US7863396B2Silicon compoundsCHISSO CORP·Filed 2004·Granted Jan 4, 2011·3 cites·27 claims
- 1264US7291747B2Silicon compounds and process for preparation thereofCHISSO CORP·Filed 2002·Granted Nov 6, 2007·5 cites·38 claims
- 1362US7399819B2Silicon compoundCHISSO CORP·Filed 2003·Granted Jul 15, 2008·3 cites·10 claims
- 1452US2023151237A1Photocurable composition, inkjet ink composition, active energy ray-curable ink composition, cured product, and electronic componentJNC CORP·Filed 2021·Application pending·0 cites
- 1541US2020048480A1Photocurable inkjet inkJNC CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →