Inventor · disambiguated record
Hideaki Oka
Also filed as: OKA HIDEAKI
27 granted patents·7 pending applications·359 citations·filing 1974–2020
96Inventor score
Top patents by PatentIndex Score
34 records- 0190US7009029B2Polyamide compositionKURARAY CO·Filed 2003·Granted Mar 7, 2006·36 cites·18 claims
- 0289US5670608APolyamide and polyamide compositionKURARAY CO·Filed 1994·Granted Sep 23, 1997·49 cites·13 claims
- 0388US6235563B1Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 1991·Granted May 22, 2001·95 cites·41 claims
- 0487US10594003B2Battery systemTOYOTA MOTOR CO LTD·Filed 2015·Granted Mar 17, 2020·3 cites·13 claims
- 0584US9217680B2Sensor device, sensor module, robot and method of manufacturing sensor deviceSEIKO EPSON CORP·Filed 2012·Granted Dec 22, 2015·8 cites·2 claims
- 0682US6846868B2Polyamide compositionKURARAY CO·Filed 2002·Granted Jan 25, 2005·20 cites·20 claims
- 0782US6258927B1Polyamide compositionKURARAY CO·Filed 2000·Granted Jul 10, 2001·31 cites·8 claims
- 0881US6403497B1Method of manufacturing semiconductor device by two stage heating of deposited noncrystalline semiconductorSEIKO EPSON CORP·Filed 2000·Granted Jun 11, 2002·20 cites·13 claims
- 0980US9381647B2Force detection device, robot, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Jul 5, 2016·5 cites·9 claims
- 1080US9091607B2Sensor element, force detecting device, and robotSEIKO EPSON CORP·Filed 2012·Granted Jul 28, 2015·9 cites·20 claims
- 1180US9046432B2Sensor device, sensor module, force sensing apparatus, and robotSEIKO EPSON CORP·Filed 2012·Granted Jun 2, 2015·9 cites·16 claims
- 1277US6414064B1Polyamide resin compositionKURARAY CO·Filed 2001·Granted Jul 2, 2002·16 cites·26 claims
- 1375US11060890B2Sensor and robotSEIKO EPSON CORP·Filed 2018·Granted Jul 13, 2021·2 cites·16 claims
- 1475US7666795B2Method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2007·Granted Feb 23, 2010·5 cites·12 claims
- 1574US11154987B2RobotSEIKO EPSON CORP·Filed 2018·Granted Oct 26, 2021·2 cites·12 claims
- 1674US7495287B2Semiconductor device and manufacturing method thereofSEIKO EPSON CORP·Filed 2007·Granted Feb 24, 2009·6 cites·16 claims
- 1774US6156869AMethod for producing polyamidesKURARAY CO·Filed 1999·Granted Dec 5, 2000·28 cites·22 claims
- 1872US3947504ASeparation and recovery of 3-methyl-3-butene-1-olKURARAY CO·Filed 1974·Granted Mar 30, 1976·9 cites·6 claims
- 1965US10950860B2Graphite material for negative electrode of lithium ion secondary cell and method for producing the sameTOYOTA MOTOR CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·8 claims
- 2062US11309579B2Lithium ion secondary battery and method for producing the sameTOYOTA MOTOR CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·5 claims
- 2161US11114657B2Negative electrode for metal secondary battery, metal secondary battery, and method of producing metal secondary batteryTOYOTA MOTOR CO LTD·Filed 2018·Granted Sep 7, 2021·0 cites·9 claims
- 2260US6818731B2Polyamide resin compositionKURARAY CO·Filed 2003·Granted Nov 16, 2004·5 cites·17 claims
- 2357US10873087B2Metal negative electrode secondary battery and method of manufacturing sameTOYOTA MOTOR CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·5 claims
- 2456US10826066B2Lithium-ion secondary batteryTOYOTA MOTOR CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·5 claims
- 2555US9873201B2Force detection device, robot, and moving objectSEIKO EPSON CORP·Filed 2016·Granted Jan 23, 2018·0 cites·5 claims
- 2645US2008182380A1Method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 2745US2019366544A1Robot, Control Device And Method Of Controlling RobotSEIKO EPSON CORP·Filed 2019·Application pending·0 cites
- 2845US2019344451A1Robot, control device, and control method for robotSEIKO EPSON CORP·Filed 2019·Application pending·0 cites
- 2942US2007018246A1Semiconductor device and semiconductor device manufacturing methodTOKYO INST TECH·Filed 2006·Application pending·0 cites
- 3041US2002132452A1Semiconductor device and method of manufacturing the sameFiled 2002·Application pending·0 cites
- 3140US9463709B2VehicleTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 11, 2016·0 cites·6 claims
- 3240US2007102735A1Semiconductor device and method for manufacturing the semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 3339US2007075317A1Semiconductor device and semiconductor device manufacturing methodTOKYO INST TECH·Filed 2006·Application pending·0 cites
- 3438US4069261AProcess for the production of polyhydric alcoholsKURARAY CO·Filed 1975·Granted Jan 17, 1978·1 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Hideaki Oka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →