Inventor · disambiguated record
Hikaru Okubo
Also filed as: OKUBO HIKARU
5 granted patents·13 citations·filing 2001–2012
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0170US8088308B2Resin composition and semiconductor device produced by using the sameOKUBO HIKARU·Filed 2005·Granted Jan 3, 2012·5 cites·3 claims
- 0264US8217115B2Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor packageMASUDA TAKESHI·Filed 2007·Granted Jul 10, 2012·3 cites·4 claims
- 0352US8853312B2Resin composition and semiconductor device produced by using the sameSUMITOMO BAKELITE CO·Filed 2012·Granted Oct 7, 2014·0 cites·6 claims
- 0447US8614270B2Resin composition and semiconductor device produced by using the sameOKUBO HIKARU·Filed 2011·Granted Dec 24, 2013·0 cites·18 claims
- 0545US6861013B2Die-attaching paste and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2001·Granted Mar 1, 2005·5 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →