Inventor · disambiguated record
Hiroaki Okudaira
Also filed as: OKUDAIRA HIROAKI
11 granted patents·1 pending application·180 citations·filing 1986–2013
91Inventor score
Top patents by PatentIndex Score
12 records- 0194US4963974AElectronic device plated with gold by means of an electroless gold plating solutionHITACHI LTD·Filed 1988·Granted Oct 16, 1990·74 cites·36 claims
- 0278US8503189B2Pb-free solder-connected structure and electronic deviceSHIMOKAWA HANAE·Filed 2010·Granted Aug 6, 2013·3 cites·11 claims
- 0372US7013564B2Method of producing an electronic device having a PB free solder connectionHITACHI LTD·Filed 2001·Granted Mar 21, 2006·10 cites·19 claims
- 0470US7709746B2Pb-free solder-connected structure and electronic deviceRENESAS TECH CORP·Filed 2006·Granted May 4, 2010·3 cites·13 claims
- 0569US5202151AElectroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·29 cites·14 claims
- 0667US6960396B2Pb-free solder-connected structure and electronic deviceHITACHI LTD·Filed 2002·Granted Nov 1, 2005·7 cites·27 claims
- 0760US8907475B2Pb-free solder-connected structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·0 cites·12 claims
- 0858US5510976AControl systemHITACHI LTD·Filed 1994·Granted Apr 23, 1996·19 cites·24 claims
- 0956US5198273AElectroless gold plating solution and method for plating gold therewithHITACHI LTD·Filed 1990·Granted Mar 30, 1993·17 cites·14 claims
- 1052US4735853AMagnetic recording medium having an amorphous, nonmagnetic nickel-tungston-phosphorus underlayerHITACHI LTD·Filed 1986·Granted Apr 5, 1988·9 cites·18 claims
- 1142US4913769AProcess for preparing superconductive wiring boardHITACHI LTD·Filed 1988·Granted Apr 3, 1990·9 cites·8 claims
- 1235US2002009610A1Technical fieldFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →