Inventor · disambiguated record
Hironori Osuga
Also filed as: OSUGA HIRONORI
3 granted patents·1 pending application·11 citations·filing 2004–2008
63Inventor score
Top patents by PatentIndex Score
4 records- 0168US7560821B2Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the sameSUMITOMO BAKELITE CO·Filed 2006·Granted Jul 14, 2009·6 cites·4 claims
- 0266US7622515B2Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silicaSUMITOMO BAKELITE CO·Filed 2006·Granted Nov 24, 2009·5 cites·1 claims
- 0338US8178599B2Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resinOSUGA HIRONORI·Filed 2008·Granted May 15, 2012·0 cites·7 claims
- 0432US2004188676A1Epoxy resin composition and semiconductor apparatusFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →