Inventor · disambiguated record
Hideki Otsuki
Also filed as: OTSUKI HIDEKI
10 granted patents·2 pending applications·34 citations·filing 2009–2025
82Inventor score
Top patents by PatentIndex Score
12 records- 0190US12184107B2Charging controller, rechargeable battery, electronic device, and control methodLENOVO SINGAPORE PTE LTD·Filed 2023·Granted Dec 31, 2024·2 cites·7 claims
- 0288US8529787B2Colloidal silica containing silica secondary particles having bent structure and/or branched structure, and method for producing sameHIGUCHI KAZUAKI·Filed 2009·Granted Sep 10, 2013·30 cites·20 claims
- 0379US11817732B2Charing controller, rechargeable battery, electronic device, and control methodLENOVO SINGAPORE PTE LTD·Filed 2021·Granted Nov 14, 2023·1 cites·7 claims
- 0475US12325639B2Colloidal silica and production method thereforFUSO CHEMICAL CO LTD·Filed 2020·Granted Jun 10, 2025·1 cites·11 claims
- 0568US12286356B2Colloidal silica and method for producing sameFUSO CHEMICAL CO LTD·Filed 2020·Granted Apr 29, 2025·0 cites·9 claims
- 0667US2025250175A1Colloidal silica and method for producing sameFUSO CHEMICAL CO LTD·Filed 2025·Application pending·0 cites
- 0767US2025270097A1Colloidal silica and production method thereforFUSO CHEMICAL CO LTD·Filed 2025·Application pending·0 cites
- 0853US10178450B2High-speed converter, measurement system, and computer-readable mediumFANUC CORP·Filed 2017·Granted Jan 8, 2019·0 cites·8 claims
- 0951US10146201B2Numerical control apparatus, numerical control method and computer program for controlling machine toolFANUC CORP·Filed 2016·Granted Dec 4, 2018·0 cites·8 claims
- 1047US11422537B2Recognition device, system and recognition methodFANUC CORP·Filed 2019·Granted Aug 23, 2022·0 cites·6 claims
- 1146US11059180B2Control device and machine learning deviceFANUC CORP·Filed 2019·Granted Jul 13, 2021·0 cites·7 claims
- 1242US10549423B2Controller and machine learning deviceFANUC CORP·Filed 2018·Granted Feb 4, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →