Inventor · disambiguated record
Hirofumi Owaki
Also filed as: OWAKI HIROFUMI
9 granted patents·1 pending application·7 citations·filing 2017–2022
78Inventor score
Files withSONY SEMICONDUCTOR SOLUTIONS CORP10
Top patents by PatentIndex Score
10 records- 0187US12143699B2Sensor module and method for producing sensor module by laser weldingSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Nov 12, 2024·2 cites·9 claims
- 0275US11830104B2Image processing apparatus, camera system, and image processing method for superimposing an image representing a part of a vehicle bodySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Nov 28, 2023·2 cites·16 claims
- 0374US10904999B2Electronic apparatus, camera apparatus, and shield chassisSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jan 26, 2021·2 cites·11 claims
- 0469US11119389B2Image-capturing apparatus and housing componentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Sep 14, 2021·1 cites·17 claims
- 0561US12422284B2Sensor moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Sep 23, 2025·0 cites·10 claims
- 0653US2025128740A1Information processing device, information processing method, and vehicle control systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 0749US11152726B2Connector device and connector systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Oct 19, 2021·0 cites·21 claims
- 0846US12077104B2Camera moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Sep 3, 2024·0 cites·10 claims
- 0945US12212825B2Sensor moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jan 28, 2025·0 cites·11 claims
- 1043US11930258B2Camera module, spacer component, and method for producing camera moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Mar 12, 2024·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →