Inventor · disambiguated record
Hiroyuki Sada
Also filed as: SADA HIROYUKI
14 granted patents·2 pending applications·224 citations·filing 1991–2023
92Inventor score
Top patents by PatentIndex Score
16 records- 0195US11735435B2Quad flat no lead package and method of makingTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 22, 2023·6 cites·20 claims
- 0294US10658240B1Semiconductor die singulationTEXAS INSTRUMENTS INC·Filed 2019·Granted May 19, 2020·12 cites·26 claims
- 0373US6330500B1Actuation controller for air bag deviceAUTOLIV JAPAN LTD·Filed 1998·Granted Dec 11, 2001·48 cites·40 claims
- 0470US10763230B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·8 claims
- 0570US5326945AShock sensorTOKIN CORP·Filed 1992·Granted Jul 5, 1994·26 cites·7 claims
- 0669US9868502B2Stern tube sealing deviceEAGLE IND CO LTD·Filed 2013·Granted Jan 16, 2018·2 cites·3 claims
- 0769US5189311ACrash sensorSENSOR TECH KK·Filed 1991·Granted Feb 23, 1993·39 cites·10 claims
- 0868US5900807ACollision detection deviceSENSOR TECH KK·Filed 1996·Granted May 4, 1999·35 cites·4 claims
- 0967US11171031B2Die matrix expander with partitioned subringTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 9, 2021·1 cites·20 claims
- 1067US2023260839A1Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1166US5777225ACrash sensorSENSOR TECH KK·Filed 1994·Granted Jul 7, 1998·32 cites·7 claims
- 1265US11367699B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 21, 2022·0 cites·19 claims
- 1364US10665475B2Quad flat no lead package and method of makingTEXAS INSTRUMENTS INC·Filed 2014·Granted May 26, 2020·1 cites·8 claims
- 1455US11664276B2Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2018·Granted May 30, 2023·0 cites·18 claims
- 1551US5396424ACrash sensorSENSOR TECH KK·Filed 1992·Granted Mar 7, 1995·21 cites·12 claims
- 1641US2021215965A1Display deviceSHARP KK·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →