Inventor · disambiguated record
Hiroyuki Sagawa
Also filed as: SAGAWA HIROYUKI
4 granted patents·82 citations·filing 1988–1997
78Inventor score
Files withOMRON TATEISI ELECTRONICS CO4
Top patents by PatentIndex Score
4 records- 0168US5759668AHeat seal structureOMRON TATEISI ELECTRONICS CO·Filed 1997·Granted Jun 2, 1998·34 cites·1 claims
- 0265US4814944AMounting structure for surface mounted type component with projection extending down from lower surface thereof and method of mounting a surface mounted type component on a printed circuit boardOMRON TATEISI ELECTRONICS CO·Filed 1988·Granted Mar 21, 1989·24 cites·17 claims
- 0361US4831348ALow profile electromagnetic relay to printed circuit boardOMRON TATEISI ELECTRONICS CO·Filed 1988·Granted May 16, 1989·13 cites·3 claims
- 0451US5270674AElectromagnetic relayOMRON TATEISI ELECTRONICS CO·Filed 1991·Granted Dec 14, 1993·11 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →