Inventor · disambiguated record
Hirotoshi Saito
Also filed as: SAITO HIROTOSHI
4 granted patents·7 pending applications·2 citations·filing 2010–2020
58Inventor score
Top patents by PatentIndex Score
11 records- 0181US10220441B2Method for producing silver nanowires, silver nanowires, and ink using sameDOWA HOLDINGS CO LTD·Filed 2015·Granted Mar 5, 2019·2 cites·14 claims
- 0266US10578564B2Method for producing silver nanowires, silver nanowires, and ink using sameDOWA HOLDINGS CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·12 claims
- 0349US10758977B2Silver nanowires and method for producing same, and silver nanowire ink and transparent conductive filmDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·11 claims
- 0447US2020030877A1Method for producing silver nanowire dispersion liquid having good separability among wiresDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 0546US2020061701A1Silver nanowires, method for producing same, and silver nanowire inkDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Application pending·0 cites
- 0643US2019352529A1Silver nanowire ink, method for producing same, and conductive filmDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Application pending·0 cites
- 0743US2020324643A1Fuel supply device of engineMAZDA MOTOR·Filed 2020·Application pending·0 cites
- 0840US2017278596A1Method for producing metal nanowires having improved uniformity in length distributionDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Application pending·0 cites
- 0938US2017015857A1Method for producing silver nanowires ink, silver nanowires ink, and transparent conductive coated filmDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Application pending·0 cites
- 1034US8609754B2Flame-retardant thermoplastic resin composition and molded article thereofNAITO YOSHITAKA·Filed 2010·Granted Dec 17, 2013·0 cites·8 claims
- 1132US2017132505A1Rfid tag substrate using paper substrate, and rfid tagDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →