Inventor · disambiguated record
Hiroki Sakai
Also filed as: SAKAI HIROKI
15 granted patents·6 pending applications·54 citations·filing 2004–2024
88Inventor score
Files withFUNAI ELECTRIC CO9SUMITOMO WIRING SYSTEMS5SEIKO EPSON CORP2UNIV HOKKAIDO NAT UNIV CORP2DAIICHI SANKYO CO LTD1
Top patents by PatentIndex Score
21 records- 0187US8364799B2Management server and content moving systemFUNAI ELECTRIC CO·Filed 2007·Granted Jan 29, 2013·25 cites·2 claims
- 0274US7596640B2Computer program product for managing connectionsFUNAI ELECTRIC CO·Filed 2005·Granted Sep 29, 2009·8 cites·10 claims
- 0369US2024367432A1Droplet dispensing device and control methodFUNAI ELECTRIC CO·Filed 2024·Application pending·0 cites
- 0467US7556413B2Illumination device and projectorSEIKO EPSON CORP·Filed 2007·Granted Jul 7, 2009·5 cites·18 claims
- 0567US7163296B2ProjectorSEIKO EPSON CORP·Filed 2004·Granted Jan 16, 2007·10 cites·3 claims
- 0663US9770942B2Soundproof wheel for railway vehicleNIPPON STEEL & SUMITOMO METAL CORP·Filed 2014·Granted Sep 26, 2017·2 cites·9 claims
- 0761US12191598B2Connector, wiring harness and assembly method thereforSUMITOMO WIRING SYSTEMS·Filed 2022·Granted Jan 7, 2025·0 cites·13 claims
- 0860US11973291B2First connector, second connector and connector assemblySUMITOMO WIRING SYSTEMS·Filed 2021·Granted Apr 30, 2024·0 cites·15 claims
- 0958US8595858B2Device and tamper detection systemSAKAI HIROKI·Filed 2007·Granted Nov 26, 2013·4 cites·3 claims
- 1058US2025179340A1Latent heat storage particle, heat exchange material and method for manufacturing latent heat storage particleUNIV HOKKAIDO NAT UNIV CORP·Filed 2022·Application pending·0 cites
- 1156US2024243525A1Connector and wiring harnessSUMITOMO WIRING SYSTEMS·Filed 2024·Application pending·0 cites
- 1255US12212089B2First and second connectors attachable to and detachable from each other, and connector assembly including the sameSUMITOMO WIRING SYSTEMS·Filed 2022·Granted Jan 28, 2025·0 cites·18 claims
- 1351US12500367B2Terminal unit with improved protectionSUMITOMO WIRING SYSTEMS·Filed 2021·Granted Dec 16, 2025·0 cites·8 claims
- 1450US2022298401A1Microcapsule for latent heat storage materials, method for producing same, powder containing microcapsules for latent heat storage materials, and heat storage device comprising said powderUNIV HOKKAIDO NAT UNIV CORP·Filed 2020·Application pending·0 cites
- 1549US11633962B2Printing deviceFUNAI ELECTRIC CO·Filed 2021·Granted Apr 25, 2023·0 cites·5 claims
- 1647US10925848B2Amide derivativeDAIICHI SANKYO CO LTD·Filed 2018·Granted Feb 23, 2021·0 cites·21 claims
- 1745US7574552B2Target device to be connected to IEEE 1394 serial busFUNAI ELECTRIC CO·Filed 2006·Granted Aug 11, 2009·0 cites·14 claims
- 1845US2015169272A1User interface device, user interface system, and printing deviceFUNAI ELECTRIC CO·Filed 2014·Application pending·0 cites
- 1944US11588950B2Printing device and information processing deviceFUNAI ELECTRIC CO·Filed 2020·Granted Feb 21, 2023·0 cites·16 claims
- 2042US7903686B2Connected device to be connected to an IEEE 1394 serial busFUNAI ELECTRIC CO·Filed 2007·Granted Mar 8, 2011·0 cites·6 claims
- 2138US2005259596A1Topology map displaying systemFUNAI ELECTRIC CO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →