Inventor · disambiguated record
Hiroshi Samukawa
Also filed as: SAMUKAWA HIROSHI
14 granted patents·2 pending applications·108 citations·filing 1993–2008
91Inventor score
Top patents by PatentIndex Score
16 records- 0193US7446159B1Curable resin compositionSONY CORP·Filed 2007·Granted Nov 4, 2008·21 cites·10 claims
- 0280US7868109B2Curable resin compositionSONY CORP·Filed 2007·Granted Jan 11, 2011·8 cites·11 claims
- 0363US5426008APhotocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereofGRACE W R & CO·Filed 1993·Granted Jun 20, 1995·21 cites·22 claims
- 0459US8022126B2Encapsulating resin composition and light-emitting deviceSONY CORP·Filed 2007·Granted Sep 20, 2011·1 cites·9 claims
- 0553US5869220AWaterborne photoresist emulsions and methods of preparation thereofMACDERMID ACUMEN INC·Filed 1997·Granted Feb 9, 1999·18 cites·9 claims
- 0650US2007039921A1Etching solutions and processes for manufacturing flexible wiring boardsSONY CHEM & INF DEVICE CORP·Filed 2006·Application pending·0 cites
- 0749US2008269457A1Process For Producing Polyimide Fine ParticleSONY CHEM & INF DEVICE CORP·Filed 2006·Application pending·0 cites
- 0847US6489417B1Process for producing fluorine-containing acrylic or methacrylic polymersSONY CHEMICALS CORP·Filed 1998·Granted Dec 3, 2002·8 cites·12 claims
- 0946US7144817B2Etching solutions and processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2001·Granted Dec 5, 2006·1 cites·20 claims
- 1046US6566439B2Lowly-adhesive coating materialSONY CHEMICALS CORP·Filed 2000·Granted May 20, 2003·2 cites·3 claims
- 1142US7732078B2Non-aqueous electrolyte battery pack comprising a liquid-absorbent compositionSONY CORP·Filed 2003·Granted Jun 8, 2010·0 cites·15 claims
- 1242US5565302AProcess for preparing photosensitive resin compositionGRACE W R & CO·Filed 1995·Granted Oct 15, 1996·9 cites·4 claims
- 1342US5512607AUnsaturated epoxy ester with quaternary ammonium and phosphate groupsGRACE W R & CO·Filed 1995·Granted Apr 30, 1996·11 cites·3 claims
- 1441US8076437B2Encapsulant material for optical component and light-emitting deviceHATSUDA KOUKI·Filed 2008·Granted Dec 13, 2011·0 cites·9 claims
- 1537US8072139B2Light emitting element module and method for sealing light emitting elementHATSUDA KOUKI·Filed 2006·Granted Dec 6, 2011·0 cites·9 claims
- 1636US6288148B1Acrylic emulsions containing tackifiers, processes for preparing them, and adhesive tape containing acrylic emulsions containing tackifiersSONY CHEMICALS CORP·Filed 1998·Granted Sep 11, 2001·8 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →