Inventor · disambiguated record
Hikaru Satoh
Also filed as: SATOH HIKARU
2 granted patents·9 pending applications·12 citations·filing 1992–2023
49Inventor score
Top patents by PatentIndex Score
11 records- 0161US2024043659A1Heat conducting compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0259US2023399512A1Thermally conductive compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0358US2023287213A1Thermally conductive composition, cured product and electronic componentRESONAC CORP·Filed 2023·Application pending·0 cites
- 0458US2024026055A1Surface-treated filler, method for producing surface-treated filler, and heat conducting compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0550US2024059901A1Method for producing surface-treated thermally conductive filler, and thermally conductive compositionRESONAC CORP·Filed 2021·Application pending·0 cites
- 0649US2024101885A1Heat conducting composition and cured product thereofRESONAC CORP·Filed 2022·Application pending·0 cites
- 0749US2023313017A1Thermally conductive compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0849US2024052224A1Thermally conductive compositionRESONAC CORP·Filed 2022·Application pending·0 cites
- 0947US12480031B2Thermally conductive resin composition, cured product, heat transfer member and electronic deviceRESONAC CORP·Filed 2022·Granted Nov 25, 2025·0 cites·9 claims
- 1046US5211730AMethod for heating glass bodySUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted May 18, 1993·12 cites·5 claims
- 1142US2024052223A1Thermally conductive urethane resin composition and cured productSHOWA DENKO KK·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →