Inventor · disambiguated record
Hiromichi Sawaya
Also filed as: SAWAYA HIROMICHI
13 granted patents·440 citations·filing 1987–1995
94Inventor score
Files withTOSHIBA KK13
Top patents by PatentIndex Score
13 records- 0183US5136827AWrapping member for semiconductor device and method for manufacturing the wrapping memberTOSHIBA KK·Filed 1990·Granted Aug 11, 1992·53 cites·1 claims
- 0281US5245215AMultichip packaged semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 1992·Granted Sep 14, 1993·59 cites·17 claims
- 0379US5191511ASemiconductor device including a package having a plurality of bumps arranged in a grid form as external terminalsTOSHIBA KK·Filed 1992·Granted Mar 2, 1993·63 cites·7 claims
- 0478US4951124ASemiconductor deviceTOSHIBA KK·Filed 1989·Granted Aug 21, 1990·52 cites·3 claims
- 0575US5083189AResin-sealed type IC deviceTOSHIBA KK·Filed 1990·Granted Jan 21, 1992·55 cites·6 claims
- 0672US5352632AMultichip packaged semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 1993·Granted Oct 4, 1994·40 cites·8 claims
- 0758US5314842AResin-sealed type semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 1992·Granted May 24, 1994·29 cites·4 claims
- 0853US5124783ASemiconductor device having insulating substrate adhered to conductive substrateTOSHIBA KK·Filed 1990·Granted Jun 23, 1992·22 cites·5 claims
- 0953US4807087ASingle-in-line type semiconductor deviceTOSHIBA KK·Filed 1987·Granted Feb 21, 1989·19 cites·4 claims
- 1050US5093713ASemiconductor device packageTOSHIBA KK·Filed 1991·Granted Mar 3, 1992·18 cites·13 claims
- 1149US5196992AResin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resinTOSHIBA KK·Filed 1991·Granted Mar 23, 1993·18 cites·16 claims
- 1237US4963975ASemiconductor deviceTOSHIBA KK·Filed 1990·Granted Oct 16, 1990·9 cites·12 claims
- 1332US5561324ASemiconductor chip mounting sectorTOSHIBA KK·Filed 1995·Granted Oct 1, 1996·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →