Inventor · disambiguated record
Hideki Shibata
Also filed as: SHIBATA HIDEKI
75 granted patents·14 pending applications·1,439 citations·filing 1986–2020
99Inventor score
Top patents by PatentIndex Score
89 records- 0198US8110421B2Light emitting device and method for manufacturing sameSUGIZAKI YOSHIAKI·Filed 2009·Granted Feb 7, 2012·67 cites·16 claims
- 0298US7304384B2Semiconductor device with a barrier film which contains manganeseSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Granted Dec 4, 2007·87 cites·15 claims
- 0398US7032307B2Method for fabricating a probe pin for testing electrical characteristics of an apparatusTOSHIBA KK·Filed 2004·Granted Apr 25, 2006·110 cites·15 claims
- 0493US6071810AMethod of filling contact holes and wiring grooves of a semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 6, 2000·101 cites·2 claims
- 0592US6673704B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Jan 6, 2004·42 cites·26 claims
- 0692US6541861B2Semiconductor device manufacturing method including forming step of SOI structure and semiconductor device having SOI structureTOSHIBA KK·Filed 2001·Granted Apr 1, 2003·70 cites·4 claims
- 0790US7485915B2Semiconductor device and method having capacitor and capacitor insulating film that includes preset metal elementTOSHIBA KK·Filed 2006·Granted Feb 3, 2009·20 cites·15 claims
- 0889US8373192B2Semiconductor light emitting deviceTOSHIBA KK·Filed 2010·Granted Feb 12, 2013·11 cites·20 claims
- 0988US8436378B2Semiconductor light emitting device and method for manufacturing sameKOJIMA AKIHIRO·Filed 2010·Granted May 7, 2013·10 cites·22 claims
- 1088US8377726B2Method for manufacturing light emitting device and light emitting deviceTOSHIBA KK·Filed 2010·Granted Feb 19, 2013·10 cites·17 claims
- 1188US8133813B2Semiconductor device with a barrier filmKOIKE JUNICHI·Filed 2011·Granted Mar 13, 2012·5 cites·10 claims
- 1288US8130070B2Multiple fuse device for a vehicleSHIBATA HIDEKI·Filed 2008·Granted Mar 6, 2012·17 cites·14 claims
- 1387US8378377B2Light emitting deviceTOSHIBA KK·Filed 2010·Granted Feb 19, 2013·9 cites·16 claims
- 1486US7943517B2Semiconductor device with a barrier filmSEMICONDUCTOR TECH ACAD RES CT·Filed 2007·Granted May 17, 2011·9 cites·6 claims
- 1585US8884327B2Semiconductor light emitting device and method for manufacturing sameSUGIZAKI YOSHIAKI·Filed 2010·Granted Nov 11, 2014·4 cites·26 claims
- 1685US6291891B1Semiconductor device manufacturing method and semiconductor deviceTOSHIBA KK·Filed 1999·Granted Sep 18, 2001·69 cites·26 claims
- 1784US8868233B2Control apparatus, a substrate treating method, a substrate treating system, a method of operating a substrate treating system, a load port control apparatus, and a substrate treating system having the load port control apparatusSHIBATA HIDEKI·Filed 2012·Granted Oct 21, 2014·6 cites·17 claims
- 1884US5023679ASemiconductor deviceTOSHIBA KK·Filed 1989·Granted Jun 11, 1991·44 cites·4 claims
- 1983US9184357B2Light emitting device and method for manufacturing sameSUGIZAKI YOSHIAKI·Filed 2011·Granted Nov 10, 2015·5 cites·38 claims
- 2083US8475315B2Swing internal contact type planetary gear device and rotation drive deviceKOBAYASHI TSUNE·Filed 2011·Granted Jul 2, 2013·9 cites·5 claims
- 2183US8152676B2Speed change gearKOBAYASHI TSUNE·Filed 2011·Granted Apr 10, 2012·9 cites·3 claims
- 2282US7795733B2Semiconductor device having aerial wiring and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Sep 14, 2010·9 cites·15 claims
- 2382US6555925B1Semiconductor device and producing method thereofTOSHIBA KK·Filed 2000·Granted Apr 29, 2003·33 cites·12 claims
- 2480US9782847B2Gear machining deviceJTEKT CORP·Filed 2015·Granted Oct 10, 2017·4 cites·12 claims
- 2580US6781236B2Semiconductor device using a multilayer wiring structureTOSHIBA KK·Filed 2002·Granted Aug 24, 2004·30 cites·11 claims
- 2680US6534870B1Apparatus and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Mar 18, 2003·32 cites·18 claims
- 2779US10311721B1Traffic control systemYAMAHA MOTOR CO LTD·Filed 2018·Granted Jun 4, 2019·5 cites·20 claims
- 2879US6307265B1Feasible, gas-dielectric interconnect processTOSHIBA KK·Filed 1996·Granted Oct 23, 2001·49 cites·85 claims
- 2979US6163067ASemiconductor apparatus having wiring groove and contact hole in self-alignment mannerTOSHIBA KK·Filed 1998·Granted Dec 19, 2000·49 cites·19 claims
- 3078US6784680B2Contact probe with guide unit and fabrication method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Aug 31, 2004·18 cites·15 claims
- 3178US6724208B2Probe pin for testing electrical characteristics of apparatus, probe card using probe pinsTOSHIBA KK·Filed 2000·Granted Apr 20, 2004·17 cites·16 claims
- 3277US5330934AMethod of fabricating a semiconductor device having miniaturized contact electrode and wiring structureTOSHIBA KK·Filed 1993·Granted Jul 19, 1994·49 cites·19 claims
- 3377US5243220ASemiconductor device having miniaturized contact electrode and wiring structureTOSHIBA KK·Filed 1992·Granted Sep 7, 1993·51 cites·7 claims
- 3476US11008119B2Aircraft platformYAMAHA MOTOR CO LTD·Filed 2018·Granted May 18, 2021·4 cites·12 claims
- 3576US9620669B2Semiconductor light emitting device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Apr 11, 2017·2 cites·10 claims
- 3676US6563218B2Semiconductor device of multi-wiring structure and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted May 13, 2003·19 cites·11 claims
- 3774US6946387B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2003·Granted Sep 20, 2005·11 cites·2 claims
- 3872USD560172SFusePACIFIC ENGINEERING CORP·Filed 2007·Granted Jan 22, 2008·15 cites·1 claims
- 3972US6368951B2Semiconductor device manufacturing method and semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 9, 2002·16 cites·4 claims
- 4072US5976972AMethod of making semiconductor apparatus having wiring groove and contact hole formed in a self-alignment mannerTOSHIBA KK·Filed 1996·Granted Nov 2, 1999·38 cites·33 claims
- 4171US5350712AMethod of manufacturing a semiconductor IC device having multilayer interconnection structureTOSHIBA KK·Filed 1993·Granted Sep 27, 1994·44 cites·10 claims
- 4270US7115999B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Oct 3, 2006·16 cites·13 claims
- 4369US9176496B2Substrate treating systemSHIBATA HIDEKI·Filed 2012·Granted Nov 3, 2015·2 cites·17 claims
- 4468US7768127B2Semiconductor device including multi-layered interconnection and method of manufacturing the deviceTOSHIBA KK·Filed 2005·Granted Aug 3, 2010·3 cites·20 claims
- 4568US6750138B2Semiconductor device of multi-wiring structure and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Jun 15, 2004·12 cites·8 claims
- 4666USD549058SFuse pullerPACIFIC ENGINEERING CORP·Filed 2006·Granted Aug 21, 2007·14 cites·1 claims
- 4763US6972491B2Semiconductor device including multi-layered interconnection and method of manufacturing the deviceTOSHIBA KK·Filed 2004·Granted Dec 6, 2005·9 cites·16 claims
- 4863US6919617B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2003·Granted Jul 19, 2005·9 cites·22 claims
- 4962US7589014B2Semiconductor device having multiple wiring layers and method of producing the sameTOSHIBA KK·Filed 2006·Granted Sep 15, 2009·1 cites·6 claims
- 5062US5814541AMethod for manufacturing semiconductor deviceTOSHIBA KK·Filed 1995·Granted Sep 29, 1998·27 cites·3 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →