Inventor · disambiguated record
Hiroki Shibuya
Also filed as: SHIBUYA HIROKI
9 granted patents·6 pending applications·53 citations·filing 2009–2022
81Inventor score
Files withRENESAS ELECTRONICS CORP8DEXERIALS CORP2FUJITSU LTD2NEC ELECTRONICS CORP1OTSUKA PHARMA CO LTD1
Top patents by PatentIndex Score
15 records- 0189USD635461SBottleOTSUKA PHARMA CO LTD·Filed 2009·Granted Apr 5, 2011·47 cites·1 claims
- 0274US10085425B2Electronic apparatus and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 2, 2018·2 cites·18 claims
- 0367US10056332B2Electronic device with delamination resistant wiring boardRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·1 cites·15 claims
- 0465US9705363B2Communication control device and mounting boardRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 11, 2017·3 cites·16 claims
- 0555US2018310529A1Electronic apparatus and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 0654US11773208B2Cationically curable composition and cured product production methodDEXERIALS CORP·Filed 2019·Granted Oct 3, 2023·0 cites·11 claims
- 0750US10396031B2Electronic device with delamination resistant wiring boardRENESAS ELECTRONICS CORP·Filed 2018·Granted Aug 27, 2019·0 cites·4 claims
- 0849US11839012B2Static eliminatorSHIBUYA HIROKI·Filed 2020·Granted Dec 5, 2023·0 cites·16 claims
- 0947US2024384147A1Thermally conductive composition and thermally conductive sheetDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1044US9585192B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·0 cites·20 claims
- 1143US2009201656A1Semiconductor package, and method of manufacturing semiconductor packageNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1239US2014198970A1Edge detection device and edge detection methodFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1336US11032909B2Electronic apparatusRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 8, 2021·0 cites·9 claims
- 1436US2016128179A1Electronic apparatus and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1536US2019066285A1Image inspection apparatus, image inspection method, and image inspection programFUJITSU LTD·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hiroki Shibuya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →