Inventor · disambiguated record
Hiroyuki Shigeta
Also filed as: SHIGETA HIROYUKI
9 granted patents·2 pending applications·82 citations·filing 1996–2021
86Inventor score
Top patents by PatentIndex Score
11 records- 0184US12132061B2Semiconductor device, imaging device, and method of manufacturing semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Oct 29, 2024·2 cites·16 claims
- 0269US6319749B1Lead frame, semiconductor package having the same and method for manufacturing the sameSONY CORP·Filed 2000·Granted Nov 20, 2001·15 cites·5 claims
- 0368US11942495B2Semiconductor device, imaging apparatus, and method for manufacturing semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Mar 26, 2024·2 cites·26 claims
- 0467US9170841B2Multiprocessor system for comparing execution order of tasks to a failure patternPANASONIC CORP·Filed 2012·Granted Oct 27, 2015·3 cites·13 claims
- 0561US6107678ALead frame and semiconductor package having a lead frameSONY CORP·Filed 1997·Granted Aug 22, 2000·24 cites·12 claims
- 0658US10714402B2Semiconductor chip package for improving freedom of arrangement of external terminalsSONY CORP·Filed 2017·Granted Jul 14, 2020·1 cites·12 claims
- 0753US12456669B2Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Oct 28, 2025·0 cites·44 claims
- 0850US6054773ASemiconductor device and method of manufacturing the sameSONY CORP·Filed 1998·Granted Apr 25, 2000·17 cites·8 claims
- 0949US5812381ALead frame and integrated circuit package using the lead frameSONY CORP·Filed 1996·Granted Sep 22, 1998·18 cites·17 claims
- 1046US2025096087A1Semiconductor package and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 1140US2022262841A1Semiconductor package, electronic device, and method of manufacturing semiconductor packageSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →