Inventor · disambiguated record
Hitomi Shigyo
Also filed as: SHIGYO HITOMI
6 granted patents·169 citations·filing 1995–1998
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0182US5846477AProduction method for encapsulating a semiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Dec 8, 1998·78 cites·10 claims
- 0263US5834850AEncapsulated semiconductor device having metal foil covering, and metal foilNITTO DENKO CORP·Filed 1996·Granted Nov 10, 1998·26 cites·13 claims
- 0356US6319619B1Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor deviceNITTO DENKO CORP·Filed 1998·Granted Nov 20, 2001·22 cites·19 claims
- 0455US5674343AMethod for manufacturing a semiconductorNITTO DENKO CORP·Filed 1995·Granted Oct 7, 1997·18 cites·19 claims
- 0552US5904505AProcess for producing encapsulated semiconductor device having metal foil material covering and metal foilNITTO DENKO CORP·Filed 1997·Granted May 18, 1999·16 cites·1 claims
- 0640US6117513ASemiconductor device and a lamination and fixing material used in the method of manufacture of the semiconductor deviceNITTO DENK CORP·Filed 1997·Granted Sep 12, 2000·9 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Hitomi Shigyo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →