Inventor · disambiguated record
Hiroshi Shiho
Also filed as: SHIHO HIROSHI
28 granted patents·10 pending applications·609 citations·filing 2000–2007
97Inventor score
Top patents by PatentIndex Score
38 records- 0195US7329174B2Method of manufacturing chemical mechanical polishing padJSR CORP·Filed 2006·Granted Feb 12, 2008·50 cites·4 claims
- 0293US7173180B2Silane composition, silicon film forming method and solar cell production methodJSR CORP·Filed 2006·Granted Feb 6, 2007·20 cites·24 claims
- 0392US6485838B1Coating composition, and a coated film and glass each having a coating layer comprised thereofJSR CORP·Filed 2000·Granted Nov 26, 2002·61 cites·15 claims
- 0491US7067069B2Silane composition, silicon film forming method and solar cell production methodJSR CORP·Filed 2002·Granted Jun 27, 2006·45 cites·19 claims
- 0590USD584591SPolishing padJSR CORP·Filed 2007·Granted Jan 13, 2009·38 cites·1 claims
- 0689USD600989SPolishing padJSR CORP·Filed 2007·Granted Sep 29, 2009·33 cites·1 claims
- 0789USD592029SPolishing padJSR CORP·Filed 2007·Granted May 12, 2009·34 cites·1 claims
- 0889USD592030SPolishing padJSR CORP·Filed 2007·Granted May 12, 2009·34 cites·1 claims
- 0988US6656602B1Gas barrier coating composition, process for producing the same, and gas barrier coating filmJSR CORP·Filed 2000·Granted Dec 2, 2003·31 cites·16 claims
- 1086USD559063SPolishing padJSR CORP·Filed 2004·Granted Jan 8, 2008·27 cites·1 claims
- 1184USD559066SPolishing padJSR CORP·Filed 2005·Granted Jan 8, 2008·25 cites·1 claims
- 1282US6660394B1Coating composition and hardened film obtained therefromJSR CORP·Filed 2000·Granted Dec 9, 2003·30 cites·17 claims
- 1381US6992123B2Polishing padJSR CORP·Filed 2003·Granted Jan 31, 2006·28 cites·31 claims
- 1479USD581237SPolishing padJSR CORP·Filed 2007·Granted Nov 25, 2008·21 cites·1 claims
- 1579USD576855SPolishing padJSR CORP·Filed 2007·Granted Sep 16, 2008·21 cites·1 claims
- 1678US7183213B2Chemical mechanical polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2004·Granted Feb 27, 2007·18 cites·10 claims
- 1773US6875518B2Ruthenium film, ruthenium oxide film and process for forming the sameJSR CORP·Filed 2001·Granted Apr 5, 2005·8 cites·16 claims
- 1872US7323415B2Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor waferJSR CORP·Filed 2004·Granted Jan 29, 2008·14 cites·27 claims
- 1972US6512062B1Polymerization of non-fluorinated monomers in carbon dioxideUNIV NORTH CAROLINA STATE·Filed 2000·Granted Jan 28, 2003·12 cites·37 claims
- 2069US6953821B2Aqueous dispersion, process for production thereof and coated substancesJSR CORP·Filed 2001·Granted Oct 11, 2005·9 cites·19 claims
- 2165US7354527B2Chemical mechanical polishing pad and chemical mechanical polishing processJSR CORP·Filed 2005·Granted Apr 8, 2008·2 cites·20 claims
- 2263USD559064SPolishing padJSR CORP·Filed 2004·Granted Jan 8, 2008·10 cites·1 claims
- 2359USD559648SPolishing padJSR CORP·Filed 2005·Granted Jan 15, 2008·11 cites·1 claims
- 2459USD559065SPolishing padJSR CORP·Filed 2005·Granted Jan 8, 2008·11 cites·1 claims
- 2554US6976910B2Polishing padJSR CORP·Filed 2004·Granted Dec 20, 2005·5 cites·15 claims
- 2651US6806210B2Tantalum oxide film, use thereof, process for forming the same and compositionJSR CORP·Filed 2001·Granted Oct 19, 2004·4 cites·29 claims
- 2747US7442116B2Chemical mechanical polishing padJSR CORP·Filed 2004·Granted Oct 28, 2008·1 cites·8 claims
- 2846USD560457SPolishing padJSR CORP·Filed 2005·Granted Jan 29, 2008·6 cites·1 claims
- 2946US2004224611A1Polishing pad and method of polishing a semiconductor waferJSR CORP·Filed 2004·Application pending·0 cites
- 3044US2004224616A1Polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2004·Application pending·0 cites
- 3141US2005245171A1Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafersJSR CORP·Filed 2005·Application pending·0 cites
- 3241US2003187113A1Gas barrier coating composition and method for manufacturing sameJSR CORP·Filed 2003·Application pending·0 cites
- 3341US2005222336A1Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing processJSR CORP·Filed 2005·Application pending·0 cites
- 3440US2005260929A1Chemical mechanical polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2005·Application pending·0 cites
- 3539US2004203320A1Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing methodJSR CORP·Filed 2004·Application pending·0 cites
- 3639US2005239380A1Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing methodJSR CORP·Filed 2005·Application pending·0 cites
- 3738US2004266326A1Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing padFiled 2003·Application pending·0 cites
- 3836US2004014413A1Polishing pad and multi-layer polishing padJSR CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →