Inventor · disambiguated record
Hiroki Shiota
Also filed as: SHIOTA HIROKI
15 granted patents·3 pending applications·92 citations·filing 1997–2022
89Inventor score
Files withMITSUBISHI ELECTRIC CORP14HIRAMATSU SEIKI1MIMURA KENJI1PANASONIC IP MAN CO LTD1SHIOTA HIROKI1
Top patents by PatentIndex Score
18 records- 0184US6130496AStator coil for rotary electric machineMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 10, 2000·70 cites·18 claims
- 0280US9797955B2Insulation inspection device for motors and insulation inspection method for motorsMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Oct 24, 2017·4 cites·20 claims
- 0371US8193633B2Heat conductive sheet and method for producing same, and powder moduleMIMURA KENJI·Filed 2008·Granted Jun 5, 2012·6 cites·7 claims
- 0470US11972991B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 30, 2024·2 cites·20 claims
- 0568US10110083B2Stator of rotary electric machine and rotary electric machineMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Oct 23, 2018·2 cites·4 claims
- 0663US8236666B2Semiconductor device and process for producing sameHIRAMATSU SEIKI·Filed 2007·Granted Aug 7, 2012·3 cites·8 claims
- 0762US7868436B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Jan 11, 2011·3 cites·14 claims
- 0861US9287201B2Semiconductor deviceSHIOTA HIROKI·Filed 2011·Granted Mar 15, 2016·2 cites·14 claims
- 0955US10996257B2Insulating substrate inspecting method and inspecting apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 4, 2021·0 cites·20 claims
- 1051US12068217B2Frame member with a porous material between a semiconductor module and heat sinkMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 20, 2024·0 cites·17 claims
- 1145US11251105B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 1242US2023278254A1Method for manufacturing fiber board and biomass compressed material for manufacturing fiber boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1341US10727145B2Semiconducter device with filler to suppress generation of air bubbles and electric power converterMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·0 cites·20 claims
- 1440US10692794B2Radiation plate structure, semiconductor device, and method for manufacturing radiation plate structureMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 23, 2020·0 cites·7 claims
- 1540US9293390B2Heat radiation structure for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Mar 22, 2016·0 cites·5 claims
- 1639US2024194613A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1738US2025343093A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1834US10199340B2Signal transmission insulative device and power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 5, 2019·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →