Inventor · disambiguated record
Hirokuni Shirono
Also filed as: SHIRONO HIROKUNI
8 granted patents·3 pending applications·128 citations·filing 1999–2003
88Inventor score
Files withNIPPON AEROSIL CO LTD9
Top patents by PatentIndex Score
11 records- 0186US6077640AFine powder of hydrophobic metal oxide, method for producing it, and toner composition for electrophotographyNIPPON AEROSIL CO LTD·Filed 1999·Granted Jun 20, 2000·45 cites·21 claims
- 0275US7083770B2Amorphous, fine silica particles, and method for their production and their useNIPPON AEROSIL CO LTD·Filed 2001·Granted Aug 1, 2006·13 cites·19 claims
- 0373US6620508B2Oxide powder and method for preparing the same, and product using the sameNIPPON AEROSIL CO LTD·Filed 2000·Granted Sep 16, 2003·16 cites·34 claims
- 0470US6677095B2Fine metal oxide powder having high dispersibility and toner composition comprising the sameNIPPON AEROSIL CO LTD·Filed 2000·Granted Jan 13, 2004·19 cites·18 claims
- 0569US7255843B2Low viscosity-increment fumed-silica and its slurryNIPPON AEROSIL CO LTD·Filed 2002·Granted Aug 14, 2007·9 cites·24 claims
- 0660US6994834B1Surface-modified fine silica powder and use thereofNIPPON AEROSIL CO LTD·Filed 2000·Granted Feb 7, 2006·8 cites·10 claims
- 0751US6224980B1Fine powder of hydrophobic titanium oxide, and method for producing itNIPPON AEROSIL CO LTD·Filed 1999·Granted May 1, 2001·10 cites·5 claims
- 0844US2005203214A1Surface modified inorganic oxide powder and its useNIPPON AEROSIL CO LTD·Filed 2003·Application pending·0 cites
- 0939US2004105964A1Aqueous nanoparticle ceramic agglomerate dispersion for forming ink-absorbing layer of ink-jet recording mediumFiled 2003·Application pending·0 cites
- 1036US2002041952A1Aqueous nanoparticle ceramic agglomerate dispersion for forming ink-absorbing layer of ink-jet recording mediumFiled 2001·Application pending·0 cites
- 1132US6352679B1Ultrafine particle silicon dioxide and process for producing the sameNIPPON AEROSIL CO LTD·Filed 1999·Granted Mar 5, 2002·8 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →