Inventor · disambiguated record
Hiroki Sudo
Also filed as: SUDO HIROKI
12 granted patents·9 pending applications·4 citations·filing 2018–2024
81Inventor score
Top patents by PatentIndex Score
21 records- 0193US12109653B2Solder alloy, solder ball, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2023·Granted Oct 8, 2024·1 cites·11 claims
- 0281US2024424615A1Solder Alloy, Solder Ball, Solder Paste, and Solder JointSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0373US10639749B2Cu core ball, solder joint, solder paste and formed solderSENJU METAL INDUSTRY CO·Filed 2019·Granted May 5, 2020·2 cites·16 claims
- 0472US11344976B2Solder material, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Granted May 31, 2022·1 cites·19 claims
- 0569US2024100635A1Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2023·Application pending·0 cites
- 0661US12447565B2Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 0759US11872656B2Core material, electronic component and method for forming bump electrodeSENJU METAL INDUSTRY CO·Filed 2020·Granted Jan 16, 2024·0 cites·4 claims
- 0855US11478869B2Method for forming bump electrode substrateSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 25, 2022·0 cites·10 claims
- 0953US10610979B2Flux composition for solder applicationsSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 7, 2020·0 cites·2 claims
- 1048US10888959B2Cu core ball, solder joint, solder paste and formed solderSENJU METAL INDUSTRY CO·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 1148US2025349228A1Secure computation device, secure computation method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 1246US12475237B2Secure computation apparatus, secure computation system, secure computation method, and programNTT INC·Filed 2021·Granted Nov 18, 2025·0 cites·6 claims
- 1346US12412487B2Secret calculation system, apparatus, method and programNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Granted Sep 9, 2025·0 cites·6 claims
- 1445US12386948B2Secure computation apparatus, secure computation system, secure computation method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Granted Aug 12, 2025·0 cites·5 claims
- 1544US2025150265A1Secure computation apparatus, secure computation method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 1644US2025148095A1Secure computation apparatus, secure computation method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 1744US2022413802A1Computation apparatus, method and program for the sameNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
- 1844US2024184577A1Secret calculation system, apparatus, method and programNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Application pending·0 cites
- 1943US2024061904A1Secure relational algebraic operation system, secure computation apparatus, secure relational algebraic operation method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Application pending·0 cites
- 2041US12095906B2Secret survival data processing system, secret survival data processing apparatus, secret survival data processing method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Sep 17, 2024·0 cites·8 claims
- 2140US2019376161A1Cu Core Ball, Solder Joint, Solder Paste and Formed SolderSENJU METAL INDUSTRY CO·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →