Inventor · disambiguated record
Hideyuki Sumi
Also filed as: SUMI HIDEYUKI
11 granted patents·109 citations·filing 1987–2015
90Inventor score
Top patents by PatentIndex Score
11 records- 0190US9801802B2Viscous compositionDAI-ICHI KOGYO SEIYAKU CO LTD·Filed 2015·Granted Oct 31, 2017·2 cites·4 claims
- 0283US9248090B2Viscous compositionISOGAI AKIRA·Filed 2010·Granted Feb 2, 2016·2 cites·2 claims
- 0375US9901527B2Viscous compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 2015·Granted Feb 27, 2018·1 cites·5 claims
- 0472US5654369AAntistatic thermoplastic resin compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1996·Granted Aug 5, 1997·31 cites·4 claims
- 0563US5202193AN-substituted acrylamide copolymerKAI ICHI KOGYO SEIYAKU CO LTD·Filed 1991·Granted Apr 13, 1993·20 cites·14 claims
- 0656US4774022AConductive film-forming compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1987·Granted Sep 27, 1988·10 cites·9 claims
- 0754US5859141AThermoplastic resin composition comprising cation-modified acrylamide or methacrylamide copolymerDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1997·Granted Jan 12, 1999·13 cites·3 claims
- 0854US5332780ACompositions containing allylformamide copolymersDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1993·Granted Jul 26, 1994·13 cites·16 claims
- 0949US5717048ACation-modified acrylamide or methacrylamide copolymer as well as antistatic agent, thermoplastic resin composition, aqueous composition and thermoplastic resin laminate comprising sameDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1995·Granted Feb 10, 1998·11 cites·4 claims
- 1037US5420210AFormamide group-containing copolymer, process for producing the same, and thermoplastic resin composition containing the sameDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1992·Granted May 30, 1995·3 cites·6 claims
- 1134US5541242AThermoplastic resin with (meth)acrylamide or aminoalkyl (meth)acrylate copolymerDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1994·Granted Jul 30, 1996·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →