Inventor · disambiguated record
Hiroshi Tadano
Also filed as: TADANO HIROSHI
8 granted patents·4 pending applications·105 citations·filing 1986–2005
87Inventor score
Top patents by PatentIndex Score
12 records- 0174US6960485B2Light-emitting device using a group III nitride compound semiconductor and a method of manufactureTOYODA GOSEI KK·Filed 2003·Granted Nov 1, 2005·21 cites·2 claims
- 0272US6600385B2Front end module for mobile communications apparatusTDK CORP·Filed 2001·Granted Jul 29, 2003·18 cites·8 claims
- 0369US4752818ASemiconductor device with multiple recombination center layersTOYODA CHUO KENKYUSHO KK·Filed 1986·Granted Jun 21, 1988·37 cites·11 claims
- 0458US5940314AUltra-high density memory deviceTOYODA CHUO KENKYUSHO KK·Filed 1998·Granted Aug 17, 1999·14 cites·15 claims
- 0556US7505451B2Usage-based charging device and usage-based charging methodSONY CORP·Filed 2001·Granted Mar 17, 2009·9 cites·19 claims
- 0646US2005133799A1Light-emitting device using a group III nitride compound semiconductor and a method of manufactureTOYODA GOSEI KK·Filed 2005·Application pending·0 cites
- 0742US2003135458A1System and method for providing service by proxyFiled 2001·Application pending·0 cites
- 0837US2001028062A1Light-emitting device using a group III nitride compound semiconductor and a method of manufactureFiled 2001·Application pending·0 cites
- 0931US4998149AStatic induction type semiconductor deviceTOYODA CHUO KENKYUSHO KK·Filed 1988·Granted Mar 5, 1991·3 cites·9 claims
- 1031US2002165807A1Method for calculating communication charge, apparatus for calculating communication charge and method for charging communicationFiled 2001·Application pending·0 cites
- 1130US5304822AStatic induction type semiconductor device with multiple source contact regionsTOYODA AUTOMATIC LOOM WORKS·Filed 1992·Granted Apr 19, 1994·2 cites·8 claims
- 1229US4994870AStatic induction type semiconductor deviceTOYODA AUTOMATIC LOOM WORKS·Filed 1990·Granted Feb 19, 1991·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →