Inventor · disambiguated record
Hideyasu Tagusari
Also filed as: TAGUSARI HIDEYASU
2 granted patents·53 citations·filing 1997–1998
66Inventor score
Top patents by PatentIndex Score
2 records- 0172US5858517AElectrodeposited copper foil for printed wiring board and method of manufacturing the sameMITSUI MINING & SMELTING CO·Filed 1997·Granted Jan 12, 1999·24 cites·4 claims
- 0261US5897761AElectrodeposited copper foil for printed wiring board and method for manufacturing the sameMITSUI MINING & SMLETING CO LT·Filed 1998·Granted Apr 27, 1999·29 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →