Inventor · disambiguated record
Hitoshi Takano
Also filed as: TAKANO HITOSHI
8 granted patents·5 pending applications·160 citations·filing 1991–2018
87Inventor score
Top patents by PatentIndex Score
13 records- 0190US5910357ASeparation membrane and method of producing the same, and shape memory polymer compositionNITTO DENKO CORP·Filed 1997·Granted Jun 8, 1999·81 cites·22 claims
- 0278US6328169B1Frame structure for housing panel platesNIKKO KOGYO KK·Filed 2000·Granted Dec 11, 2001·26 cites·4 claims
- 0376US6948623B2Frame for housing plate materialsNIX INC·Filed 2003·Granted Sep 27, 2005·22 cites·10 claims
- 0463US6749072B2Frame structure for housing panel platesNIX INC·Filed 2002·Granted Jun 15, 2004·14 cites·9 claims
- 0550US6321919B1Frame structure for housing panel platesNIKKO KOGYO KK·Filed 2000·Granted Nov 27, 2001·6 cites·11 claims
- 0645US10705626B2Image display device and control method for image display deviceSEIKO EPSON CORP·Filed 2018·Granted Jul 7, 2020·0 cites·8 claims
- 0744US5178667ADry process for refining zinc sulfide concentratesSUMITOMO METAL MINING CO·Filed 1991·Granted Jan 12, 1993·7 cites·26 claims
- 0844US2010323191A1Pressure-Sensitive Adhesive TapeNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 0940US2020001717A1Display deviceNIPPON SEIKI CO LTD·Filed 2018·Application pending·0 cites
- 1038US2003087088A1Resin sealing method for semiconductors and release film used thereforNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 1136US2002142153A1Resin sealing method for semiconductors and release film used thereforFiled 2000·Application pending·0 cites
- 1233US2002136872A1Lead frame laminate and method for manufacturing semiconductor partsFiled 2001·Application pending·0 cites
- 1325US5355814AGasifier burner for powdered solid fuels and method for using the sameSUMITOMO METAL MINING CO·Filed 1993·Granted Oct 18, 1994·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →