Inventor · disambiguated record
Hidekiyo Takaoka
Also filed as: TAKAOKA HIDEKIYO
34 granted patents·7 pending applications·171 citations·filing 1999–2018
96Inventor score
Top patents by PatentIndex Score
41 records- 0192US10413992B2Method for joining structural material, joining sheet, and joint structureMURATA MANUFACTURING CO·Filed 2016·Granted Sep 17, 2019·5 cites·10 claims
- 0290US9105987B2Connection structureMURATA MANUFACTURING CO·Filed 2013·Granted Aug 11, 2015·11 cites·10 claims
- 0390US8975527B2Circuit boardTAKAOKA HIDEKIYO·Filed 2012·Granted Mar 10, 2015·12 cites·6 claims
- 0490US7276841B2Thick film electrode and multilayer ceramic electronic deviceMURATA MANUFACTURING CO·Filed 2006·Granted Oct 2, 2007·23 cites·10 claims
- 0587US9044816B2Solder paste, joining method using the same and joined structureNAKANO KOSUKE·Filed 2012·Granted Jun 2, 2015·8 cites·14 claims
- 0680US8222751B2Electroconductive bonding material and electronic apparatusNOMURA AKIHIRO·Filed 2009·Granted Jul 17, 2012·4 cites·12 claims
- 0778US10050355B2Conductive material, bonding method using the same, and bonded structureMURATA MANUFACTURING CO·Filed 2013·Granted Aug 14, 2018·2 cites·24 claims
- 0877US9691546B2Electronic part and method for forming joint structure of electronic part and joining objectMURATA MANUFACTURING CO·Filed 2014·Granted Jun 27, 2017·2 cites·11 claims
- 0975US9113571B2Electronic component module and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2013·Granted Aug 18, 2015·4 cites·8 claims
- 1074US8227536B2Lead-free solder paste and its useWATANABE SHIZUHARU·Filed 2006·Granted Jul 24, 2012·10 cites·11 claims
- 1174US6660226B1Lead free solder and soldered articleMURATA MANUFACTURING CO·Filed 2000·Granted Dec 9, 2003·11 cites·4 claims
- 1273US9414513B2Electronic component moduleMURATA MANUFACTURING CO·Filed 2014·Granted Aug 9, 2016·4 cites·19 claims
- 1372US9162324B2Solder paste and solder jointNAKANO KOSUKE·Filed 2006·Granted Oct 20, 2015·3 cites·12 claims
- 1472US6139979ALead-free solder and soldered articleMURATA MANUFACTURING CO·Filed 1999·Granted Oct 31, 2000·30 cites·4 claims
- 1571US10994366B2Repair method and repair materialMURATA MANUFACTURING CO·Filed 2018·Granted May 4, 2021·0 cites·12 claims
- 1670US7777398B2Piezoelectric actuatorMURATA MANUFACTURING CO·Filed 2007·Granted Aug 17, 2010·6 cites·20 claims
- 1768US9614295B2Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic partMURATA MANUFACTURING CO·Filed 2015·Granted Apr 4, 2017·1 cites·5 claims
- 1868US9209527B2Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic partMURATA MANUFACTURING CO·Filed 2013·Granted Dec 8, 2015·1 cites·7 claims
- 1968US7488445B2Lead-free solder and soldered articleMURATA MANUFACTURING CO·Filed 2007·Granted Feb 10, 2009·1 cites·14 claims
- 2067US9333593B2Joining method, joint structure and method for producing the sameMURATA MANUFACTURING CO·Filed 2014·Granted May 10, 2016·1 cites·9 claims
- 2167US6703113B2Pb-free solder composition and soldered articleMURATA MANUFACTURING CO·Filed 2001·Granted Mar 9, 2004·10 cites·18 claims
- 2266US9572255B2Electronic device, bonding material, and method for producing electronic deviceMURATA MANUFACTURING CO·Filed 2014·Granted Feb 14, 2017·1 cites·20 claims
- 2363US8920580B2Solder paste and electronic deviceTAKAOKA HIDEKIYO·Filed 2007·Granted Dec 30, 2014·2 cites·20 claims
- 2461US9412517B2Electronic partMURATA MANUFACTURING CO·Filed 2014·Granted Aug 9, 2016·0 cites·12 claims
- 2561US7422721B2Lead-free solder and soldered articleMURATA MANUFACTURING CO·Filed 2006·Granted Sep 9, 2008·0 cites·10 claims
- 2659US2016288245A1Repair method and repair materialMURATA MANUFACTURING CO·Filed 2016·Application pending·0 cites
- 2758US10090268B2Method of forming solder bump, and solder bumpMURATA MANUFACTURING CO·Filed 2015·Granted Oct 2, 2018·1 cites·16 claims
- 2858US8802998B2Ceramic multilayer substrate and method for producing the sameOKADA YOSHIKO·Filed 2010·Granted Aug 12, 2014·2 cites·5 claims
- 2957US8105687B2Electroconductive bonding material and electronic apparatusNOMURA AKIHIRO·Filed 2010·Granted Jan 31, 2012·0 cites·7 claims
- 3055US6180264B1Soldered articleMURATA MANUFACTURING CO·Filed 1999·Granted Jan 30, 2001·12 cites·14 claims
- 3150US10010980B2Solder paste, joining method using the same and joined structureMURATA MANUFACTURING CO·Filed 2015·Granted Jul 3, 2018·0 cites·12 claims
- 3250US9370111B2Ceramic multilayer substrate and method for producing the sameMURATA MANUFACTURING CO·Filed 2014·Granted Jun 14, 2016·0 cites·4 claims
- 3350US7022282B2Lead-free solder and soldered articleMURATA MANUFACTURING CO·Filed 2002·Granted Apr 4, 2006·2 cites·15 claims
- 3450US2014193650A1Electroconductive material, and connection method and connection structure using the sameMURATA MANUFACTURING CO·Filed 2014·Application pending·0 cites
- 3550US2015072165A1Bonding memberMURATA MANUFACTURING CO·Filed 2014·Application pending·0 cites
- 3650US2014356055A1Joining method, joint structure and method for producing the sameMURATA MANUFACTURING CO·Filed 2014·Application pending·0 cites
- 3748US2014178703A1Electroconductive material, and connection method and connection structure using the sameMURATA MANUFACTURING CO·Filed 2014·Application pending·0 cites
- 3847US9409247B2Joining method, method for producing electronic device and electronic partMURATA MANUFACTURING CO·Filed 2014·Granted Aug 9, 2016·0 cites·5 claims
- 3946US6614641B2Ceramic electronic componentMURATA MANUFACTURING CO·Filed 2002·Granted Sep 2, 2003·2 cites·19 claims
- 4041US2004096632A1Pb-free solder composition and soldered articleMURATA MANUFACTURING CO·Filed 2003·Application pending·0 cites
- 4140US2002192106A1Lead-free solder and soldered articleMURATA MANUFACTURING CO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →