Inventor · disambiguated record
Hiroaki Takezawa
Also filed as: TAKEZAWA HIROAKI
29 granted patents·2 pending applications·362 citations·filing 1996–2020
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD23PANASONIC CORP4CANON KK2MATSUSHITA ELECTRIC INDUSTIRAL1NAKAO TAKETOSHI1
Top patents by PatentIndex Score
31 records- 0188US7755893B2Display devicePANASONIC CORP·Filed 2006·Granted Jul 13, 2010·19 cites·3 claims
- 0286US6300576B1Printed-circuit board having projection electrodes and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 9, 2001·74 cites·18 claims
- 0385US7705536B2Display devicePANASONIC CORP·Filed 2006·Granted Apr 27, 2010·15 cites·24 claims
- 0482US6512183B2Electronic component mounted member and repair method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·25 cites·15 claims
- 0575US6853074B2Electronic part, an electronic part mounting element and a process for manufacturing such the articlesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 8, 2005·16 cites·16 claims
- 0675US6694613B2Method for producing a printed-circuit board having projection electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 24, 2004·18 cites·18 claims
- 0775US6510059B2Conductive resin, electronic module using conductive resin, and method of manufacturing electronic moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 21, 2003·19 cites·23 claims
- 0874US6521144B2Conductive adhesive and connection structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 18, 2003·15 cites·14 claims
- 0972US6675474B2Electronic component mounted member and repair method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 13, 2004·14 cites·5 claims
- 1072US6429382B1Electrical mounting structure having an elution preventive filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 6, 2002·16 cites·23 claims
- 1170US6916433B2Conductive adhesive, apparatus for mounting electronic component, and method for mounting the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jul 12, 2005·17 cites·18 claims
- 1265US6465082B1Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted bodyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 15, 2002·31 cites·27 claims
- 1364US6666994B2Conductive adhesive and packaging structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 23, 2003·9 cites·25 claims
- 1464US6376051B1Mounting structure for an electronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 23, 2002·4 cites·18 claims
- 1564US6207550B1Method for fabricating bump electrodes with a leveling step for uniform heightsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 27, 2001·30 cites·6 claims
- 1656US10329112B2Drive transmission apparatus and image forming apparatusCANON KK·Filed 2018·Granted Jun 25, 2019·0 cites·20 claims
- 1756US7151306B2Electronic part, and electronic part mounting element and an process for manufacturing such the articlesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 19, 2006·4 cites·3 claims
- 1856US6749889B2Method for producing mounting structure for an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 15, 2004·4 cites·9 claims
- 1953US6569512B2Mounting structure for an electronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·3 cites·5 claims
- 2051US11548757B2Image forming apparatusCANON KK·Filed 2020·Granted Jan 10, 2023·0 cites·12 claims
- 2149US6814893B2Conductive adhesive agent, packaging structure, and method for manufacturing the same structureMATSUSHITA ELECTRIC INDUSTIRAL·Filed 2003·Granted Nov 9, 2004·2 cites·7 claims
- 2249US2009180042A1Display apparatusPANASONIC CORP·Filed 2009·Application pending·0 cites
- 2348US6620345B2Conductive adhesive agent, packaging structure, and method for manufacturing the same structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 16, 2003·2 cites·7 claims
- 2447US6524721B2Conductive adhesive and packaging structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 25, 2003·2 cites·19 claims
- 2546US6749774B2Conductive adhesive and connection structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 15, 2004·1 cites·7 claims
- 2643US6488869B2Conductive paste, its manufacturing method, and printed wiring board using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 3, 2002·8 cites·24 claims
- 2741US2008239634A1Flat Panel Display DeviceNAKAO TAKETOSHI·Filed 2006·Application pending·0 cites
- 2840US6203919B1Insulating film and method for preparing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 20, 2001·6 cites·4 claims
- 2936US6495247B1Functional member having molecular layer on its surface and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 17, 2002·4 cites·40 claims
- 3030US7468206B1Organic ultra-thin filmPANASONIC CORP·Filed 1997·Granted Dec 23, 2008·1 cites·3 claims
- 3130US5817190AFlux for soft solderingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 6, 1998·3 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →