Inventor · disambiguated record
Hiroaki Tamemoto
Also filed as: TAMEMOTO HIROAKI
19 granted patents·6 pending applications·168 citations·filing 1994–2024
92Inventor score
Top patents by PatentIndex Score
25 records- 0196US9324791B2Semiconductor elementNICHIA CORP·Filed 2014·Granted Apr 26, 2016·52 cites·8 claims
- 0291US9209351B1Method for manufacturing light emitting elementNICHIA CORP·Filed 2015·Granted Dec 8, 2015·4 cites·8 claims
- 0391US9142712B2Method for manufacturing light emitting elementNICHIA CORP·Filed 2014·Granted Sep 22, 2015·7 cites·11 claims
- 0487US5608280ACommutator type rotary electric machineNIPPON DENSO CO·Filed 1995·Granted Mar 4, 1997·71 cites·16 claims
- 0586US9653644B2Method for manufacturing semiconductor elementNICHIA CORP·Filed 2016·Granted May 16, 2017·7 cites·19 claims
- 0679US8728916B2Method for manufacturing semiconductor elementTAMEMOTO HIROAKI·Filed 2010·Granted May 20, 2014·6 cites·17 claims
- 0768US10115857B2Method for manufacturing semiconductor element of polygon shapeNICHIA CORP·Filed 2016·Granted Oct 30, 2018·1 cites·17 claims
- 0866US5428330AMagnet switchNIPPON DENSO CO·Filed 1994·Granted Jun 27, 1995·20 cites·11 claims
- 0964US11945173B2Resin member machining method, resin member machining apparatus, and resin component manufacturing methodLASER SYSTEMS INC·Filed 2022·Granted Apr 2, 2024·0 cites·25 claims
- 1063US2025040322A1Method of manufacturing optical member, and light emitting deviceNICHIA CORP·Filed 2024·Application pending·0 cites
- 1162US12319007B2Method for producing resin partNICHIA CORP·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1260US11489086B2Method of manufacturing light emitting elementNICHIA CORP·Filed 2020·Granted Nov 1, 2022·0 cites·23 claims
- 1360US2024405155A1Method for transferring light-emitting element and method for manufacturing light-emitting deviceNICHIA CORP·Filed 2024·Application pending·0 cites
- 1459US12213417B2Plant conveyance and irradiation apparatusNICHIA CORP·Filed 2020·Granted Feb 4, 2025·0 cites·17 claims
- 1558US2024258170A1Method of manufacturing semiconductor elementNICHIA CORP·Filed 2024·Application pending·0 cites
- 1658US2024336014A1Resin component and manufacturing method thereofNICHIA CORP·Filed 2023·Application pending·0 cites
- 1755US10388827B2Method for manufacturing semiconductor element by dividing semiconductor wafer using pressing member having tip portionNICHIA CORP·Filed 2018·Granted Aug 20, 2019·0 cites·16 claims
- 1853US2023138592A1Method for manufacturing light-emitting elementNICHIA CORP·Filed 2022·Application pending·0 cites
- 1950US2025229363A1Laser adjustment method and laser machining deviceNICHIA CORP·Filed 2022·Application pending·0 cites
- 2045US11769852B2Method of cutting a substrate along dividing linesNICHIA CORP·Filed 2020·Granted Sep 26, 2023·0 cites·16 claims
- 2145US9640714B2Method for manufacturing light emitting elementNICHIA CORP·Filed 2014·Granted May 2, 2017·0 cites·15 claims
- 2244US11289621B2Method for producing semiconductor light emitting elementNICHIA CORP·Filed 2018·Granted Mar 29, 2022·0 cites·19 claims
- 2343US10672660B2Method of manufacturing semiconductor elementNICHIA CORP·Filed 2018·Granted Jun 2, 2020·0 cites·16 claims
- 2442US10084108B2Method for manufacturing light emitting elementNICHIA CORP·Filed 2017·Granted Sep 25, 2018·0 cites·15 claims
- 2539US12233481B2Laser processing device, and method for manufacturing chipNICHIA CORP·Filed 2020·Granted Feb 25, 2025·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →