Inventor · disambiguated record
Hisahiro Tanaka
Also filed as: TANAKA HISAHIRO
19 granted patents·5 pending applications·278 citations·filing 1995–2021
94Inventor score
Top patents by PatentIndex Score
24 records- 0189US10028049B2HeadphonesSONY CORP·Filed 2015·Granted Jul 17, 2018·10 cites·20 claims
- 0288US7689255B2In-vehicle apparatusSONY CORP·Filed 2007·Granted Mar 30, 2010·11 cites·19 claims
- 0387US6646330B2Lead frame for semiconductor device, process for producing the same and semiconductor device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 11, 2003·58 cites·8 claims
- 0483US6395583B1Semiconductor device with a coating of Pb-free Sn-base solder and manufacturing method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 28, 2002·40 cites·13 claims
- 0583US6087714ASemiconductor devices having tin-based solder film containing no lead and process for producing the devicesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 11, 2000·74 cites·6 claims
- 0672US10943596B2Audio processing device, image processing device, microphone array system, and audio processing methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 9, 2021·2 cites·7 claims
- 0771US10598591B2Moisture content observation device, moisture content observation method, cultivation device and samplePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 24, 2020·1 cites·11 claims
- 0870US9363907B2In-vehicle electronic apparatusSONY CORP·Filed 2013·Granted Jun 7, 2016·3 cites·4 claims
- 0966US10706448B2Service monitoring system and service monitoring methodPANASONIC IP MAN CO LTD·Filed 2015·Granted Jul 7, 2020·2 cites·19 claims
- 1063US7488408B2Tin-plated film and method for producing the samePANASONIC CORP·Filed 2005·Granted Feb 10, 2009·3 cites·4 claims
- 1163US6677056B2Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 13, 2004·12 cites·6 claims
- 1260US6575354B2Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 10, 2003·10 cites·19 claims
- 1359US6521358B1Lead frame for semiconductor device and method of producing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Feb 18, 2003·23 cites·13 claims
- 1458US2021158828A1Audio processing device, image processing device, microphone array system, and audio processing methodPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1551US6159623APalladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 12, 2000·17 cites·25 claims
- 1650US7494100B2Electronic equipment tilting and rotating apparatusSONY CORP·Filed 2004·Granted Feb 24, 2009·4 cites·6 claims
- 1746US6666964B2Method of manufacturing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 23, 2003·2 cites·7 claims
- 1845US2008311414A1Method of forming thin metal film and thin metal film manufactured by the forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1944US2009011143A1Pattern forming apparatus and pattern forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2041US2007291083A1Ink jet head unit, ink jet recording apparatus, and method of manufacturing ink jet headMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 2140US2008024563A1Piezoelectric thin film element, ink jet head, and ink jet type recording apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 2237USD853985SHeadphoneSONY CORP·Filed 2017·Granted Jul 16, 2019·1 cites·1 claims
- 2336US9665904B2Order entry system and order entry methodPANASONIC IP MAN CO LTD·Filed 2015·Granted May 30, 2017·0 cites·9 claims
- 2436US5622331AMethod and apparatus for winding a wire on a work pieceSONY CORP·Filed 1995·Granted Apr 22, 1997·5 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →