Inventor · disambiguated record
Hiroshi Taneda
Also filed as: TANEDA HIROSHI
11 granted patents·3 pending applications·13 citations·filing 2016–2024
80Inventor score
Top patents by PatentIndex Score
14 records- 0196US11117184B2Aircraft panel production method and aircraft panel production systemMITSUBISHI HEAVY IND LTD·Filed 2016·Granted Sep 14, 2021·9 cites·11 claims
- 0280US10905005B2Wiring board, laminated wiring board, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2019·Granted Jan 26, 2021·4 cites·20 claims
- 0361US2025183184A1Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 0459US2025167096A1Interconnect substrateSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 0557US2025120010A1Wiring boardSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 0656US11792927B2Interconnect substrateSHINKO ELECTRIC IND CO·Filed 2022·Granted Oct 17, 2023·0 cites·8 claims
- 0754US11716810B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 1, 2023·0 cites·7 claims
- 0852US12341088B2Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structureSHINKO ELECTRIC IND CO·Filed 2022·Granted Jun 24, 2025·0 cites·9 claims
- 0951US12168339B2Interior member for aircraft, manufacturing method of the same, and replacement method of the sameMITSUBISHI HEAVY IND LTD·Filed 2019·Granted Dec 17, 2024·0 cites·6 claims
- 1051US11729914B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 15, 2023·0 cites·12 claims
- 1151US10993322B2Circuit board, laminated circuit board, and method of manufacturing circuit boardSHINKO ELECTRIC IND CO·Filed 2020·Granted Apr 27, 2021·0 cites·6 claims
- 1250US12506241B2Wiring board comprising three or more insulating layers, where a post wall waveguide of staircase shape is formed thereinSHINKO ELECTRIC IND CO·Filed 2023·Granted Dec 23, 2025·0 cites·7 claims
- 1350US12057384B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted Aug 6, 2024·0 cites·8 claims
- 1444US10593621B2Semiconductor device with barrier layerSHINKO ELECTRIC IND CO·Filed 2018·Granted Mar 17, 2020·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →