Inventor · disambiguated record
Hidekazu Tanisawa
Also filed as: TANISAWA HIDEKAZU
3 granted patents·0 citations·filing 2013–2018
40Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0145US11462449B2Semiconductor deviceNISSAN MOTOR·Filed 2018·Granted Oct 4, 2022·0 cites·7 claims
- 0245US9698082B2Au-based solder die attachment semiconductor device and method for manufacturing the sameNISSAN MOTOR·Filed 2013·Granted Jul 4, 2017·0 cites·10 claims
- 0343US10461050B2Bonding pad structure of a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →