Inventor · disambiguated record
Hiroyoshi Taya
Also filed as: TAYA HIROYOSHI
15 granted patents·1 pending application·52 citations·filing 2004–2019
92Inventor score
Top patents by PatentIndex Score
16 records- 0192US8053875B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·11 cites·20 claims
- 0288US8592961B2Method of manufacturing a semiconductor deviceDANNO TADATOSHI·Filed 2012·Granted Nov 26, 2013·5 cites·36 claims
- 0388US8513785B2Method of manufacturing a semiconductor deviceDANNO TADATOSHI·Filed 2011·Granted Aug 20, 2013·5 cites·21 claims
- 0485US9806035B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 31, 2017·2 cites·10 claims
- 0585US9024419B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted May 5, 2015·3 cites·15 claims
- 0685US7833833B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 16, 2010·5 cites·23 claims
- 0784US9425165B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 23, 2016·2 cites·18 claims
- 0882US9698125B2Power module with a plurality of patterns with convex and concave sideRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 4, 2017·4 cites·17 claims
- 0977US7282396B2Method of manufacturing a semiconductor device including using a sealing resin to form a sealing bodyRENESAS TECH CORP·Filed 2004·Granted Oct 16, 2007·10 cites·3 claims
- 1075US7691677B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Apr 6, 2010·2 cites·5 claims
- 1174US10236274B2Semiconductor device with metal patterns having convex and concave sidesRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 19, 2019·2 cites·13 claims
- 1273US9666518B1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted May 30, 2017·1 cites·7 claims
- 1369US10998288B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted May 4, 2021·0 cites·17 claims
- 1467US10249595B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 2, 2019·0 cites·3 claims
- 1558US2008006916A1Method of Manufacturing a Semiconductor DeviceRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 1654US9576885B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 21, 2017·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →